Integrated IC Device Compact Design Space Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional IC devices occupy excessive space due to separately packaged resistances, capacitors, and inductances, limiting their compactness and usability in electric apparatuses, where they cannot be stacked for efficient use.
Innovation Solution
An IC device with a compact design featuring an IC board, metal layers, and insulated layers, incorporating concave areas for conductive plates, impedance elements, and conductive coils to integrate resistances, capacitors, and inductances, allowing for a slim and compact form factor and enabling stacking of multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resistances, capacitors and inductances are separately packaged on the IC board, then each component can be independently manufactured and assembled, but the IC device occupies excessive space and cannot be stacked for efficient use
Solution Approach 1:
The patent merges multiple separately packaged components (resistances, capacitors, inductances) into a single integrated IC device structure. The components are integrated on the same IC board with shared conductive medium areas, eliminating the need for separate packaging and assembly, thereby significantly reducing the overall space occupancy while maintaining independent manufacturability of each component layer
Solution Approach 2:
The patent transitions from a two-dimensional layout of separately packaged components to a three-dimensional integrated structure with multiple metal layers (first metal layer, second metal layer) stacked vertically. This dimensional change allows components to be arranged in layers rather than spread out horizontally, reducing the footprint area while preserving all necessary component functions
2Adaptability or versatility
If conventional IC devices are used individually, then each device can be independently configured, but multiple devices cannot be piled up for efficient use
Solution Approach 1:
The patent segments the IC device into distinct functional layers (first metal layer with conductive plates, insulated layer with impedance elements, second metal layer with conductive coils) that can be independently configured during manufacturing. Each layer maintains its independent functionality while being integrated into a single compact device, allowing the device to be independently configured yet efficiently stacked with other identical devices
Solution Approach 2:
The patent creates a universal IC device structure where the same integrated design can serve multiple functions (resistance, capacitance, inductance) within a single device. This multi-functional design allows identical devices to be stacked and interconnected through their standardized conductive medium areas, enabling efficient space utilization while maintaining independent configurability
Data Source
AI summary
An IC device has a compact design. Capacitors, resistances and inductances are directly integrated in the IC device without packaging in advance. Thus, the IC device obtained has a slim size and an electric apparatus using the IC device has a big space for use.