Integrated Igniter Chip with Thick Lead Frame for Surge Protection

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Solution Overview

Problem

Existing igniter designs face challenges in downsizing the protection element due to heat generation from high-energy high-voltage surges and have a high manufacturing cost due to the separate formation of switching and control circuit components.

Innovation Solution

The integration of a switching element and protection element, including a protective resistor and Zener diode, within the same semiconductor chip, with the resistor protection Zener diode having a lower breakdown voltage than the protective resistor, and the use of a thick semiconductor chip lead frame for enhanced heat radiation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the protection element is formed separately from the switching element and control circuit section, then the protection element can be designed with high thermal rating to handle high-energy high-voltage surges, but the number of components increases and manufacturing cost increases

Engineering Contradiction:

Improvesurge protection capabilityVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the protection element with the switching element and control circuit section into a single integrated semiconductor chip. This merging eliminates the need for separate protection components while maintaining surge protection capability through the integrated design, thereby reducing the total number of components and simplifying the device structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated semiconductor chip serves multiple functions simultaneously: it acts as both the switching element for ignition control and the protection element for surge protection, while also housing the control circuit section. This multi-functionality allows a single component to replace what would traditionally require multiple separate components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If the protection element is formed separately, then adequate heat dissipation area can be provided, but the protection element size cannot be reduced and the igniter cannot be downsized

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidprotection element area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

By merging the protection element with the switching element on the same semiconductor chip, the heat dissipation responsibilities are combined. The switching element's existing thermal management infrastructure serves both the switching function and the protection function, eliminating the need for a separate large-area heat dissipation structure for the protection element.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The semiconductor chip substrate acts as an intermediary thermal path, conducting heat from both the switching element and the protection element to common heat dissipation structures. This shared thermal pathway allows efficient heat dissipation without requiring separate large-area heat sinks for each component.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the protection element is formed separately, then each component can be optimized independently, but the manufacturing cost increases due to multiple components

Engineering Contradiction:

Improvecomponent optimizationVSAvoidmanufacturing cost

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent merges multiple functions into a single semiconductor chip fabrication process. By forming the switching element, control circuit section, and protection element in the same chip, the patent benefits from economies of scale in semiconductor manufacturing, reducing per-unit costs compared to assembling multiple separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical assembly of multiple separate components with a monolithic semiconductor fabrication process. This substitution eliminates assembly costs, reduces manufacturing steps, and leverages the high-volume, low-cost nature of semiconductor manufacturing to reduce overall production costs.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the downsizing of the protection element and reduction in the number of components, leading to a more compact igniter design and lower manufacturing costs while maintaining effective surge protection.

Implementation Method 1

a resistor protection Zener diode having a breakdown voltage lower than a dielectric strength voltage of the protective resistor is connected in parallel with the protective resistor

Methodology Applied

Scientific EffectZener breakdown: Avalanche Breakdown

Implementation Method 2

the use of a thick semiconductor chip lead frame for enhanced heat radiation efficiency

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10443557B2Igniter

Publication Date: 2019.10.15 DENSO CORP

AI summary

An igniter includes a switching element, a control circuit section, and a protection element. The switching element is connected to a primary winding of an ignition coil. The control circuit section is configured to control operation of the switching element. The protection element is configured to electrically protect the control circuit section. The switching element and the protection element are formed in the same semiconductor chip, and are mounted on the same lead frame.