Integrated Image Sensor Package for 2D/3D Depth Sensing
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Solution Overview
Problem
The integration of a light source into mobile computing systems for time-of-flight imaging poses challenges related to cost, packaging, and power consumption, as traditional approaches require separate components for image capture and depth sensing.
Innovation Solution
An integrated semiconductor package that combines an image sensor and a light source driver, including visible light and depth pixels, where the light source drive signal is generated within the package to enable both 2D and 3D imaging capabilities, reducing the need for separate illuminators and supporting electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a light source is integrated into mobile computing systems for time-of-flight imaging, then depth sensing capability is improved, but device complexity and packaging difficulty increase
Solution Approach 1:
The patent combines the image sensor and light source driver into a single integrated semiconductor package. The driver circuit is fabricated on the same semiconductor substrate as the image sensor array, eliminating the need for separate light source components and reducing packaging complexity. This merging approach maintains depth sensing capability while simplifying the overall device structure.
Solution Approach 2:
The integrated driver circuit serves multiple functions: it drives the light source for time-of-flight depth sensing, provides timing signals for the image sensor, and enables both 2D and 3D imaging modes. This multi-functionality reduces the number of separate components needed, thereby reducing packaging difficulty while enhancing versatility.
2Ease of manufacture
If separate components are used for image capture and depth sensing, then manufacturing simplicity is maintained, but cost and power consumption increase
Solution Approach 1:
The patent integrates the light source driver circuit directly onto the image sensor substrate, reducing the total number of discrete components from multiple separate parts to a single integrated unit. This consolidation maintains manufacturing simplicity through standard semiconductor fabrication processes while reducing component quantity and associated costs.
3Adaptability or versatility
If multiple separate components are used for 2D and 3D imaging, then functional independence is maintained, but power consumption increases
Solution Approach 1:
The integrated driver circuit provides timing signals and control functions for both 2D image capture and 3D depth sensing operations. By sharing the driver and timing infrastructure between both imaging modes, the system reduces redundant power consumption while maintaining full functional capability for both 2D and 3D imaging.
Data Source
AI summary
An apparatus is described that includes an image sensor and a light source driver circuit integrated in a same semiconductor chip package. The image sensor includes visible light pixels and depth pixels. The depth pixels are to sense light generated with a light source drive signal. The light source drive signal is generated with the light source driver circuit.