Integrated Inductor Capacitor Overlap Mounting Area Reduction
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Solution Overview
Problem
Existing electronic components, such as coil components combined with surface-mounted components, require a large mounting area due to separate areas needed for each type of component on a circuit board.
Innovation Solution
An electronic component configuration that integrates inductors and capacitors within a compact structure, where capacitors overlap inductors, reducing the overall size and eliminating the need for additional lead conductive layers, thus minimizing the mounting area required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coil component and surface mounted electronic component are mounted separately on circuit board, then each component can be independently designed and manufactured, but mounting area increases
Solution Approach 1:
The patent combines the coil component and surface mounted electronic component into a single integrated component. The electronic component includes a substrate with a coil structure formed by conductive layers, and a surface mounted component (such as a capacitor) is mounted on the same substrate. This merging eliminates the need for separate mounting areas on the circuit board while maintaining independent design and manufacturing capabilities through modular construction.
Solution Approach 2:
The surface mounted electronic component is positioned to overlap with the coil component in the vertical direction when viewed from above. This nesting arrangement allows the component to occupy three-dimensional space efficiently, reducing the planar mounting area footprint while maintaining functional independence of both the coil and the surface mounted component.
2Area of stationary object
If mounting area is reduced by integrating components, then space efficiency improves, but connection reliability may deteriorate
Solution Approach 1:
The patent utilizes the vertical dimension by allowing the surface mounted electronic component to overlap with the coil component when viewed from the top. This three-dimensional arrangement reduces the planar mounting area while maintaining adequate separation and connection paths in the vertical direction, thereby preserving connection reliability despite reduced footprint.
3Reliability
If inductor Q value is improved using magnetic insulating layers, then inductor performance increases, but manufacturing complexity increases
Solution Approach 1:
The patent employs magnetic insulating layers that combine magnetic properties with insulating properties in a single material layer. These layers are formed between the conductive layers of the coil structure, providing both magnetic enhancement for improved Q value and electrical insulation. The use of composite materials achieves performance improvement while minimizing the increase in manufacturing complexity through integrated material selection rather than multiple separate layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact configuration reduces the mounting area needed, suppresses disconnection issues, and improves the Q value of inductors by using magnetic insulating layers, resulting in a more efficient and reliable electronic component.
Implementation Method 1
one or more first inductor conductive layers (30a, 34a) having substantially a spiral shape when viewed from the first direction side relative to the first main surface
Implementation Method 2
improves the Q value of inductors by using magnetic insulating layers
Data Source
AI summary
An electronic component includes a first inductor which is provided on a first direction side relative to a first main surface, which includes one or more first inductor conductive layers having substantially a spiral shape when viewed from the first direction side, and which includes a first end portion and a second end portion; a first outer electrode and a second outer electrode provided on a surface different from the first main surface of a substrate; and a first surface mounted electronic component which is provided on the first direction side relative to the first inductor, which overlaps the first inductor when viewed from the first direction side, and which includes a third outer electrode and a fourth outer electrode.