Integrated Inductor Structure for Thin, Stable Electrode Connections
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Solution Overview
Problem
Existing integrally-formed inductors face challenges in mechanical strength between electrodes and bare metal wire, and in reducing the thickness of the inductive component, which affects electrical performance and yield rate due to instability in contact resistance and potential rupture at joint points.
Innovation Solution
The integration of a metal structure with a bare conductor wire and electrodes, where the electrodes are thicker than the wire, forming a contiguous metal path, and a magnetic body encapsulates the wire and electrodes, enhancing mechanical strength and reducing thickness for improved performance and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are formed by electroplating process on magnetic body surfaces, then electrical connection is achieved, but contact resistance becomes unstable and electrical performance deteriorates
Solution Approach 1:
The patent merges the electrode and magnetic body into a single integrally-formed component, eliminating the separate electroplating process. The electrode and magnetic body are formed simultaneously in one molding operation, ensuring stable electrical connection without the instability associated with electroplated surfaces.
Solution Approach 2:
The electrode structure is pre-formed with proper geometry and connection points before being integrated with the magnetic body. The molding process preliminarily establishes the electrode shape and position, ensuring stable contact resistance from the outset rather than adding electrodes later through electroplating.
2Volume of moving object
If straight-line-type coil with thin wire (60 μm-70 μm) is used to reduce inductor size, then volume is reduced, but mechanical strength at joint points decreases and rupture risk increases
Solution Approach 1:
The patent merges the coil, electrodes, and magnetic body into a single integrally-formed unit. The thin wire coil is embedded within the magnetic body during molding, creating strong mechanical bonds at all joint points without requiring separate attachment processes that could compromise the weak thin wire connections.
Solution Approach 2:
The patent changes the mechanical support parameters by embedding the thin wire coil within the magnetic body matrix. This provides distributed mechanical support throughout the magnetic body, preventing rupture at joint points while maintaining the small size enabled by the thin wire geometry.
3Strength
If electrode thickness is increased to improve mechanical strength, then joint point strength increases, but inductor thickness increases and integration density decreases
Solution Approach 1:
The patent merges the electrode and magnetic body formation into a single process, allowing the electrode to be formed with optimal thickness integrated within the magnetic body. The simultaneous molding ensures the electrode has sufficient thickness for mechanical strength while the overall inductor thickness is controlled by the magnetic body dimensions.
Solution Approach 2:
The patent applies local quality by providing thicker electrode material only where needed for mechanical strength at connection points, while keeping the overall inductor thickness minimal. The electrode geometry is locally optimized in the molding process to provide strength where required without adding unnecessary thickness throughout the entire component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases mechanical strength, reduces direct current resistance, allows for thinner inductor designs, and facilitates mass production, enabling the inductor to be embedded in circuit boards with controlled thickness between 50 μm and 500 μm.
Implementation Method 1
a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode
Data Source
AI summary
A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.