Integrated Inertial and Pressure Sensor on Single Substrate
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Solution Overview
Problem
Current MEMS inertial and pressure sensors are manufactured and packaged separately, leading to complex processes, large size, and high costs, particularly evident in Tire Pressure Monitoring Systems (TPMS) where discrete sensor chips and signal processing circuits are used, resulting in inefficiencies.
Innovation Solution
An integrated inertial sensor and pressure sensor is developed using a single substrate with conductive layers, where the inertial sensor's movable sensitive element and the pressure sensor's sensitive film are formed on the same substrate, sharing conductive layers for electrical interconnecting and shielding, reducing size and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discrete inertial sensor chip and pressure sensor chip are manufactured separately and packaged together, then each sensor can be optimized independently, but the overall process becomes complicated and the size increases
Solution Approach 1:
The patent combines the inertial sensor and pressure sensor into a single integrated device manufactured on one substrate. The substrate includes both a first region for the inertial sensor and a second region for the pressure sensor, eliminating the need for separate manufacturing and packaging processes while reducing overall device complexity and size.
2Reliability
If discrete sensor chips are packaged together, then individual sensor performance is maintained, but the package size and cost increase
Solution Approach 1:
The inertial sensor and pressure sensor are merged into a single integrated package on one substrate, dramatically reducing the overall package size compared to separate chips. The substrate integrates both sensor regions with shared conductive layers and structural components, maintaining individual sensor performance while minimizing footprint.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides the structural base for both sensors, contains conductive layers for electrical interconnection of both sensors, and houses the movable sensitive element for the inertial sensor. This multi-functionality reduces the need for separate components and packaging.
3Adaptability or versatility
If separate manufacturing is used for inertial and pressure sensors, then each sensor can be independently designed, but the manufacturing cost and process time increase
Solution Approach 1:
The substrate is divided into distinct functional regions: a first region for the inertial sensor and a second region for the pressure sensor. This segmentation allows each sensor to be independently designed and optimized within its own region while being manufactured together on the same substrate, maintaining design flexibility while improving manufacturing efficiency.
Solution Approach 2:
Both sensors are manufactured in the same fabrication process on a single substrate, eliminating multiple separate manufacturing cycles. The conductive layers are formed once and serve both sensors, reducing manufacturing steps, time, and cost while maintaining the ability to independently design each sensor region.
4Ease of manufacture
If discrete chips are used with separate packaging, then assembly is straightforward, but the overall device size and complexity increase
Solution Approach 1:
The inertial sensor and pressure sensor are merged into a single integrated device on one substrate, eliminating the need for separate packaging and assembly of multiple chips. The entire device is manufactured as one unit, simplifying the overall structure and reducing assembly complexity while maintaining ease of manufacture through standard fabrication processes.
Data Source
AI summary
An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.