Integrated Interconnect Structure for Electronics Package
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Solution Overview
Problem
Current electronics packaging technologies, such as wire bond and flip chip modules, face limitations in electrical performance, reliability, and cost, with wire bond modules having high inductance and microcracking issues, and flip chip modules experiencing poor conductivity and thermal performance, while embedded modules are complex and costly.
Innovation Solution
An electronics package with an insulating substrate and an insulating structure having sloped side surfaces, where a first wiring layer extends down the sloped side surfaces and a second wiring layer through vias in the substrate electrically couples contact pads from the active surface to the first wiring layer, eliminating the need for conventional through-hole structures and providing direct thermal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonds are used to connect die pads to leadframe, then the package can be manufactured with simple processes, but the electrical performance deteriorates due to high inductance and series resistance
Solution Approach 1:
The patent extracts and eliminates the wire bond interconnect from the package structure. Instead of using wire bonds to connect die pads to leadframe, the invention integrates the interconnect directly into the substrate through patterned metal traces, removing the problematic wire bond element while maintaining manufacturing simplicity through standard PCB fabrication processes.
Solution Approach 2:
The patent merges the leadframe and substrate into an integrated structure where the substrate itself serves as the interconnect medium. The patterned metal traces on the substrate combine the functions of traditional leadframe terminals and wire bond interconnects, eliminating the need for separate wire bonds and reducing overall package complexity.
2Reliability
If PowerRibbon bonding is used to replace wire bonds, then resistance is reduced, but inductance remains high and substrate microcracking occurs
Solution Approach 1:
The patent extracts and eliminates the PowerRibbon bonding process entirely from the manufacturing sequence. Instead of applying conductive ribbons over the substrate surface, the invention incorporates conductive traces directly within the substrate layers during fabrication, removing the source of microcracking and inductance problems associated with surface-mounted bonding techniques.
Solution Approach 2:
The patent transitions the interconnect from a surface-mounted approach (PowerRibbon bonding on top of substrate) to an embedded approach (traces within substrate layers). This dimensional change from 2D surface bonding to 3D embedded routing reduces the current path length, minimizing inductance and eliminating mechanical stress that causes microcracking.
3Strength
If flip chip solder bumps are used to attach semiconductor devices, then substrate damage is reduced, but electrical conductivity and thermal cooling performance deteriorate
Solution Approach 1:
The patent inverts the traditional flip chip approach by eliminating the need for solder bumps entirely. Instead of attaching devices through conductive solder joints, the invention uses the substrate's patterned metal traces to provide both mechanical support and electrical interconnection, reversing the conventional sequence where electrical connection is established through surface-mounted joints.
Solution Approach 2:
The substrate with integrated traces serves as an intermediary that simultaneously provides mechanical support, electrical interconnection, and thermal management. This eliminates the need for separate solder bump interconnects and thermal vias, as the substrate itself mediates all three functions through its multi-layer construction with embedded conductive pathways.
4Reliability
If embedded device modules with through-hole structures are used, then electrical connections are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for devices, establishes electrical interconnections through embedded traces, enables thermal management via heat sinking, and facilitates package sealing. This multi-functionality eliminates the need for separate through-hole structures and additional interconnect layers, reducing overall device complexity while maintaining high-quality electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in high conductivity connections with low thermal resistance, reduced size, and lower costs compared to existing technologies, offering improved performance and reliability with a simpler manufacturing process.
Implementation Method 1
A metallization layer is applied to the outer surface of the dielectric film, the microvias and the exposed pads to form an electrical connection to the semiconductor devices
Data Source
AI summary
An electronics package includes an insulating substrate, an electrical component having an active surface coupled to a first surface of the insulating substrate, and an insulating structure disposed adjacent the electrical component on the first surface of the insulating substrate. A first wiring layer is formed on a top surface of the insulating structure and extends down at least one sloped side surface of the insulating structure. A second wiring layer is formed on a second surface of the insulating substrate. The second wiring layer extends through a plurality of vias in the insulating substrate to electrically couple at least one contact pad on the active surface of the electrical component to the first wiring layer.