Integrated Inverter Compressor Grounding Structure
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Solution Overview
Problem
Integrated-inverter electric compressors face challenges in simplifying the grounding structure to reduce size and noise interference, as existing solutions complicate the grounding of power-related and control-related substrates to the housing, leading to electromagnetic noise issues.
Innovation Solution
The solution involves an inverter device with a power-related metal substrate and a control-related substrate that are frame-grounded using insert-molded grounding terminals secured to the housing with screws, along with capacitors for high-frequency noise management, and branching terminal structures to ensure reliable noise current grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate frame-grounding structures are used for power-related substrate and control-related substrate, then grounding coverage is improved, but device complexity and size increase
Solution Approach 1:
The patent combines separate frame-grounding structures for power-related and control-related substrates into a single integrated grounding structure. The power-related substrate includes a first frame-grounding pattern connected to a first grounding terminal, while the control-related substrate includes a second frame-grounding pattern connected to the same first grounding terminal. This merging approach maintains comprehensive grounding coverage while reducing the number of grounding terminals and simplifying the overall grounding structure, thereby resolving the contradiction between grounding reliability and device complexity.
2Reliability
If multiple grounding terminals are used for power-related and control-related substrates, then grounding reliability is improved, but inverter device size increases
Solution Approach 1:
The patent merges multiple grounding terminals into a single shared grounding terminal. Both the power-related substrate's first frame-grounding pattern and the control-related substrate's second frame-grounding pattern are connected to the same first grounding terminal, which is then connected to the housing. This consolidation maintains effective grounding for both substrates while reducing the number of grounding terminals required, thereby decreasing the inverter device size without compromising grounding reliability.
3Device complexity
If simplified grounding structure is used to reduce size, then device complexity is reduced, but noise grounding effectiveness deteriorates
Solution Approach 1:
The patent segments the grounding function into two distinct frame-grounding patterns while using a shared grounding terminal. The power-related substrate has a first frame-grounding pattern surrounding its active elements, and the control-related substrate has a second frame-grounding pattern surrounding its active elements. Both patterns are connected to the same first grounding terminal that connects to the housing. This segmentation approach allows each substrate to have dedicated noise grounding paths while sharing the common connection point, effectively grounding electromagnetic noise without requiring multiple separate grounding terminals, thus maintaining simplicity while preserving noise grounding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances grounding reliability, reduces noise interference, and simplifies the grounding structure, thereby minimizing the size and cost of the inverter device while effectively managing electromagnetic noise.
Implementation Method 1
grounding terminals that frame-ground the power-related metal substrate and the control-related substrate to the housing are insert-molded in such a manner that the grounding terminals are securable to the inverter container with the screws
Implementation Method 2
capacitors for high-frequency noise management
Data Source
AI summary
An integrated-inverter electric compressor whose grounding effect and grounding reliability are increased by reliably grounding an inverter device to a housing and in which the size the inverter device are reduced by simplifying the grounding structure is provided. The integrated-inverter electric compressor includes an inverter device provided in an inverter container on the outer circumference of a housing. The inverter device includes an inverter module formed by integrating a power-related metal substrate and a resin case and is provided with a control-related substrate on the upper surface of the inverter module; the resin case is integrated with mounting legs provided at a plurality of locations on the circumference; the mounting legs are grounded to the power-related metal substrate and the control-related substrate; and grounding terminals, which frame-ground the substrates to the housing, are insert-molded in such a manner that the grounding terminals are securable to the inverter container with screws.