Integrated Inverter Control Circuitry on a Single Low-Cost Substrate

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Solution Overview

Problem

Alternative fuel vehicles require efficient and cost-effective power electronics devices with compact designs to manage increasing power demands, particularly in converting DC to AC power, while minimizing weight and cost, and reducing the need for expensive direct bonded copper substrates.

Innovation Solution

A power electronics device with integrated control circuitry and semiconductor die mounted on a low-cost substrate, including gate drive circuitry and insulated gate bipolar transistors (IGBTs), which eliminates the need for separate substrates and provides EMI shielding, allowing for a compact and efficient power inverter assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If direct bonded copper substrates are used in power inverters, then reliability and current handling capability are improved, but cost and weight increase

Engineering Contradiction:

ImprovereliabilityVSAvoidweight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent combines the substrate, gate drive circuitry, control circuitry, and EMI shielding into a single integrated substrate structure. This merging eliminates the need for separate direct bonded copper substrates while maintaining reliability through integrated design and proper electromagnetic interference protection.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If direct bonded copper substrates are used in power inverters, then reliability and current handling capability are improved, but cost increases

Engineering Contradiction:

ImprovereliabilityVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If separate substrates are used for power electronics and control circuitry, then functionality is improved, but device complexity and space requirements increase

Engineering Contradiction:

ImprovefunctionalityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates power electronics circuitry, gate drive circuitry, control circuitry, and EMI shielding onto a single substrate. This merging reduces device complexity and space requirements while maintaining all necessary functionalities through careful circuit design and electromagnetic interference protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves as an intermediary that integrates multiple functional components while providing EMI shielding to protect control circuitry from power electronics interference, enabling seamless coexistence of different functional blocks on the same substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Adaptability or versatility

If separate substrates are used for power electronics and control circuitry, then functionality is improved, but volume and space requirements increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidvolume

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8139371B2Power electronics devices with integrated control circuitry

Publication Date: 2012.03.20 GM GLOBAL TECHNOLOGY OPERATIONS LLC

AI summary

A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die; and control circuitry mounted on the substrate and electrically coupled to the gate drive circuitry.