Integrated IPD Filter Packaging for Substrate Space Constraints
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Solution Overview
Problem
The challenge in semiconductor packaging is the limited space on substrates due to the need for discrete IPD dies, which occupy space and require circuit matching, hindering miniaturization efforts.
Innovation Solution
Integrate an IPD die with a filter die and encapsulate them using a thin film layer and encapsulation layer, with optional retaining walls to protect the interdigital transducer, ensuring space efficiency and circuit completion without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete IPD dies are used for circuit matching, then circuit functionality is achieved, but substrate space is increased
Solution Approach 1:
The patent combines the IPD die and filter die into a single integrated package structure. The IPD die is mounted on the filter substrate, and both are encapsulated together, merging two previously separate components into one unified device that provides both filtering and circuit matching functions without requiring additional substrate space.
Solution Approach 2:
The filter substrate serves multiple functions: it acts as the base for the filter die, provides mounting surface for the IPD die, and serves as the circuit matching substrate. This multi-functional design eliminates the need for separate dedicated IPD mounting areas, thereby reducing overall substrate space requirements.
2Adaptability or versatility
If IPD die is attached to module substrate, then circuit extension is achieved, but package area is increased
Solution Approach 1:
The IPD die is integrated directly onto the filter substrate within the same package footprint, merging the circuit extension function with the filter housing. This eliminates the need for separate package areas that would be required if IPD dies were mounted as discrete components on the module substrate.
3Reliability
If retaining walls are added to prevent encapsulant entry, then protection of interdigital transducer is improved, but device complexity is increased
Solution Approach 1:
The filter die structure is segmented into distinct regions: the accommodating cavity for the interdigital transducer, the conductive pads area, and the retaining walls that create barriers. This segmentation allows the encapsulant to be directed away from sensitive components while maintaining a relatively simple overall structure that can be manufactured using standard processes.
Data Source
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AI summary
Disclosed in the present invention are a filter structure integrated with an IPD chip, a packaging module, and a manufacturing method. The filter structure comprises: an IPD chip, used for being electrically connected to a module substrate; a filter chip, disposed on the surface of the IPD chip and electrically connected to the IPD chip; a thin film layer, covering the outer sides of the IPD chip and the filter chip; and a plastic packaging layer, used for plastic packaging of the surface of the IPD chip so as to completely cover the thin film layer. According to the filter structure, an IPD chip needing to be mounted on a module substrate is integrated on a filter, so that the space utilization rate of the applied module substrate on which the filter is subsequently mounted is increased. The IPD chip is integrated as a filter packaging substrate without increasing the size of the filter so as to achieve filter packaging, and the filter is enabled to form a complete circuit, thereby ensuring the use effect of the filter.