Integrated ITSM Chiplet Controller for Faster Server Assembly
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Solution Overview
Problem
The installation of a separately assembled baseband management controller (BMC) module in servers is costly, time-consuming, and introduces potential failure points.
Innovation Solution
Integrating an information technology services management (ITSM) chiplet with processing unit chiplets in a single integrated circuit via die-to-die (D2D) interconnects, physically isolating the ITSM chiplet from the processing units, and incorporating a system root of trust (RoT) for security.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separately assembled BMC module is installed in the server, then the server can be provisioned and managed, but the assembly process becomes costly and time-consuming
Solution Approach 1:
The patent merges the BMC functionality with the processing unit by integrating the ITSM chiplet directly into the processing unit chiplet structure. This consolidation eliminates the need for separate BMC module assembly, reducing both assembly time and manufacturing complexity while maintaining all necessary server management capabilities.
2Reliability
If a separately assembled BMC module is installed in the server, then the server can be provisioned and managed, but reliability is reduced due to additional failure points
Solution Approach 1:
By combining the BMC and processing unit into a single integrated chiplet structure, the patent reduces the total number of discrete components and interconnections. This integration eliminates potential failure points associated with separate module installation while maintaining all necessary management functions, thereby improving system reliability.
3Reliability
If the ITSM chiplet is physically isolated from processing units via D2D interconnect, then security is improved, but the integration complexity increases
Solution Approach 1:
The patent segments the integrated circuit into distinct functional regions: the ITSM chiplet for management functions and the processing unit chiplet for computation. These segments are physically isolated through D2D interconnects, providing security through architectural separation while maintaining manageable integration complexity through standardized interconnection interfaces.
Data Source
AI summary
Aspects of the disclosure are directed to combining an information technology services management (ITSM) controller with one or more processing units into a single integrated circuit via chiplets. An ITSM chiplet can connect to one or more processing unit chiplets via one or more respective die-to-die (D2D) interconnects that physically isolate the ITSM chiplet from the processing unit chiplet. Including the ITSM chiplet with the processing unit chiplets in an integrated circuit can save cost, increase reliability, and reduce assembly time.