Integrated Laser Diode Package for Compact Projection Illumination
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Solution Overview
Problem
Conventional projection devices using laser diode modules with separate packages result in large sizes due to the separation distance between diodes, leading to increased device size and the need for larger lenses for higher brightness, which further enlarges the device.
Innovation Solution
The use of light emitting element package structures with multiple light emitting chips and a package lens, where the chips are arranged closely together, allowing for a compact design that reduces the size of the illumination system and projection device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate package structures are used for each laser diode, then ease of manufacture is improved, but device size increases
Solution Approach 1:
The patent merges multiple separate laser diode packages into a single integrated package structure. Multiple laser diodes are mounted on a common mounting plate within one package, eliminating the need for separate packages for each diode. This integration reduces the overall device size while maintaining manufacturing feasibility through standardized mounting processes.
Solution Approach 2:
The patent implements a nested structure where multiple laser diodes are arranged and mounted within a single package housing. The diodes are positioned in close proximity on a mounting plate, with each diode effectively nested within the same package boundary, thereby reducing the cumulative volume required compared to separate packages.
2Illumination intensity
If multiple laser diode modules are used to increase brightness, then illumination intensity is improved, but device size increases
Solution Approach 1:
The patent combines multiple laser diodes that would traditionally require separate modules into a single integrated package. This allows the system to achieve higher brightness through multiple diodes operating together while avoiding the need for multiple separate modules, each requiring its own housing and mounting infrastructure.
Solution Approach 2:
The unified package structure serves multiple functions simultaneously: it houses multiple laser diodes, provides common mounting and alignment infrastructure, and integrates optical path management for all diodes. This multi-functionality eliminates the need for separate modular components, reducing overall device size while maintaining high brightness output.
3Adaptability or versatility
If larger lenses are used to merge light from multiple modules, then light merging capability is improved, but device size increases
Solution Approach 1:
The patent combines the light paths of multiple laser diodes at an earlier stage within the integrated package, using individual collimating lenses for each diode that direct light into a common optical path. This preliminary merging eliminates the need for large downstream lenses that would be required to combine light from separate modular sources.
Solution Approach 2:
The patent performs light collimation and directional alignment preliminarily at the source level, with each laser diode equipped with its own small collimating lens within the integrated package. This preliminary action prepares the light for efficient combination downstream, eliminating the need for large merging lenses that would be required if light collection occurred at a later stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement enables a compacted size for both the illumination system and projection device, reducing the size and cost of the light condensing element while maintaining brightness and image quality.
Implementation Method 1
The package lens is disposed on the substrate and covers the light emitting chips. Each of the package lenses includes a plurality of lens units, and the lens units in each of the package lenses are integrally connected to cover the light emitting chips.
Implementation Method 2
the light condensing element is disposed on the transmission paths of the excitation light beams
Implementation Method 3
the light condensing element is disposed on the transmission paths of the excitation light beams
Data Source
AI summary
An illumination system and a projection device using this illumination system are provided. The illumination system is adapted to provide an illumination light beam. The illumination system includes a plurality of light emitting element package structures and a light condensing element. The light emitting element package structures are adapted to provide a plurality of excitation light beams, respectively. The light condensing element is disposed on transmission paths of the excitation light beams. Each of the light emitting element package structures includes a substrate, a plurality of light emitting chips, and a package lens. The light emitting chips are disposed on the substrate. The package lens is disposed on the substrate and covers the light emitting chips. Each of the package lenses includes a plurality of lens units, and the lens units in each of the package lenses are integrally connected to cover the light emitting chips.