Integrated Laser-Photodiode Flip-Chip Optical Interconnect
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Solution Overview
Problem
High-speed semiconductor devices face limitations in signal transmission speed and capacity due to cross-talk, complex wiring, and electromagnetic interference, which are addressed by the optical interconnection technique, but existing solutions require separate laser diodes and photodiodes for bi-directional connections, leading to complex configurations and high manufacturing costs.
Innovation Solution
An optical connection device is developed where a laser diode and a photodiode are integrated into a single chip with a flip chip bonding structure, allowing for bi-directional connections without the need for separate optical fibers, and a method for fabricating this device involves forming a photodiode layer, a laser diode layer, and metal posts for electrode connection, with the laser diode emitting light through an aperture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate laser diodes and photodiodes are used for bi-directional connections, then data transmission and reception can be achieved, but the configuration becomes complicated and manufacturing costs increase
Solution Approach 1:
The patent combines both the laser diode (transmitter) and photodiode (receiver) into a single integrated optical communication device. The laser diode layer and photodiode layer are formed on the same substrate, allowing bidirectional optical communication to be achieved through a single device rather than requiring separate transmitter and receiver components, thereby simplifying the overall system configuration and reducing manufacturing complexity
2Reliability
If separate laser diodes and photodiodes are used for bi-directional connections, then data transmission and reception can be achieved, but manufacturing costs increase
Solution Approach 1:
The patent combines both the laser diode (transmitter) and photodiode (receiver) into a single integrated optical communication device. The laser diode layer and photodiode layer are formed on the same substrate, allowing bidirectional optical communication to be achieved through a single device rather than requiring separate transmitter and receiver components, thereby simplifying the overall system configuration and reducing manufacturing complexity
3Reliability
If wire bonding is used for electrode connection, then electrical connections can be established, but wire bonding hindrances reduce coupling efficiency and limit transmission speed
Solution Approach 1:
The patent eliminates wire bonding from the electrode connection method. Instead of using wire bonds to connect electrodes, the invention directly forms conductive pathways through the substrate using through-electrodes that extend from one surface to the other, removing the wire bonding hindrances that limit coupling efficiency and transmission speed, thereby enabling high-speed data transmission above 10 GHz
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration simplifies the communication system, reduces manufacturing costs, and enhances coupling efficiency by eliminating wire bonding hindrances, enabling high-speed data transmission above 10 GHz and facilitating multi-channel arrays with improved durability and reliability.
Implementation Method 1
a laser diode formed on a substrate; a photodiode that is formed on the laser diode and has an aperture which is an exit of light emitted from the laser diode
Implementation Method 2
a photodiode that is formed on the laser diode and has an aperture which is an exit of light emitted from the laser diode
Implementation Method 3
a plurality of electrode pads connected to electrodes for the laser diode and the photodiode on the substrate, wherein a direction in which the light of the laser diode is emitted is opposite to a bonding direction between the laser diode and the substrate
Data Source
AI summary
Provided is an optical connection device and a method of fabricating the same. The optical connection device includes a laser diode formed on a substrate, a photodiode that is formed on the laser diode and has an aperture which is an exit of light emitted from the laser diode, and a plurality of electrode pads connected to electrodes for the laser diode and the photodiode on the substrate. A direction in which the light of the laser diode is emitted is opposite to a bonding direction between the laser diode and the substrate with respect to the laser diode.