Integrated LED and ASIC Substrate for Smart Lighting
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Solution Overview
Problem
Existing LED systems are inefficient due to complex manufacturing processes and high power consumption, leading to heat generation and reduced performance.
Innovation Solution
An LED system with an integrated semiconductor substrate that incorporates an application-specific integrated circuit (ASIC) and light emitting diode (LED) chip, providing smart functionality and reduced power consumption through optimized mounting and interconnect configurations, such as flip chip bonding and chip-on-board arrangements, along with smart control features like dimming and temperature protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional LED systems use separate driver IC and electronic components, then functionality is achieved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the driver IC, control circuits, and LED elements into a single integrated semiconductor structure. The driver circuitry is formed directly on the semiconductor substrate alongside the LED elements, eliminating the need for separate driver ICs and reducing the number of discrete components that need to be mounted and interconnected.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as the mechanical support structure, the electrical interconnection network, the housing for control circuits, and the mounting platform for LED elements. This multi-functionality reduces overall system complexity and simplifies manufacturing.
2Productivity
If traditional LED systems use separate driver IC and electronic components, then functionality is achieved, but manufacturing process complexity increases
Solution Approach 1:
The driver circuitry and LED elements are fabricated together on the same semiconductor substrate using compatible semiconductor manufacturing processes. This integration allows for batch processing and simplifies the assembly process, improving manufacturing productivity.
3Power
If traditional LED systems use separate driver IC and electronic components, then driver functionality is provided, but power consumption and heat generation increase
Solution Approach 1:
The integrated architecture reduces the number of interconnections and components, thereby reducing overall power consumption and heat generation. The close integration allows for more efficient power distribution and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated LED system achieves improved efficiency, reduced heat generation, and smaller form factor, enhancing performance and reliability while simplifying manufacturing processes.
Implementation Method 1
a light emitting diode (LED) chip (34) mounted to the substrate (32)
Data Source
AI summary
A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.