Integrally Molded Light-Emitting Device Casing for Thermal Dissipation
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Solution Overview
Problem
Existing light-emitting devices with mounted laser diodes or similar elements face poor thermal dissipation due to the connected portions between the seat and sealing cap, which hinder effective heat conduction across the entire assembly.
Innovation Solution
A light-emitting device with a casing made from a single material, featuring through holes closed by a transparent member and a lid, allowing for improved thermal conductivity and integration of light-emitting elements within the casing, which enhances heat dissipation by eliminating material bonding or welding points that act as thermal resistance sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the seat and sealing cap are connected by welding or bonding, then the structural integrity and sealing performance are improved, but the thermal dissipation performance deteriorates due to thermal resistance at connection interfaces
Solution Approach 1:
The patent merges the seat and sealing cap into a single integrated component formed from a single material. This eliminates the connection interface between separate parts, thereby removing the thermal resistance that would exist at welding or bonding joints while maintaining both structural integrity and thermal dissipation performance.
Solution Approach 2:
The patent specifies using a single material with high thermal conductivity for the entire casing structure. This ensures uniform thermal properties throughout the component and eliminates material interfaces that would create thermal resistance, while the material selection maintains both mechanical strength and thermal dissipation.
2Ease of manufacture
If the seat and sealing cap are connected by welding or bonding, then the assembly process is simplified, but the thermal dissipation performance deteriorates
Solution Approach 1:
By integrating the seat and sealing cap into one molded component, the patent eliminates multiple assembly steps (welding, bonding, or mechanical fastening) while simultaneously eliminating the thermal resistance at connection interfaces. This single-integration approach improves both manufacturability and thermal performance.
Solution Approach 2:
The patent segments the functional requirements by designing the integrated casing with distinct functional zones: the seat portion for structural support, the sealing cap portion for environmental sealing, and through-holes for light emission. This allows each function to be optimized within the unified structure without requiring separate connected parts.
3Adaptability or versatility
If separate components are used for the seat and sealing cap, then the manufacturing flexibility is improved, but the thermal dissipation and structural integrity deteriorate
Solution Approach 1:
The patent maintains manufacturing flexibility by segmenting the integrated casing into functional zones that can be independently designed and optimized. The seat portion, sealing cap portion, and through-hole configurations can be varied to meet different application requirements while maintaining the single-material construction for optimal thermal dissipation.
Solution Approach 2:
The patent enables design flexibility by allowing variation of geometric parameters (through-hole size, seat dimensions, cap shape) within the integrated structure. These parameter changes can be achieved through molding process adjustments without requiring changes to the fundamental single-component architecture, thus maintaining both thermal performance and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables enhanced thermal dissipation of heat generated by the light-emitting elements across the entire casing and attaching portions, improving the overall efficiency of heat transfer and reducing thermal resistance.
Implementation Method 1
a transparent member that closes off the one or more first through holes
Implementation Method 2
A light-emitting device on which light-emitting elements such as laser diodes or the like are mounted
Implementation Method 3
The casing is integrally formed using one material... enhanced thermal dissipation of heat generated by the light-emitting elements across the entire casing... improving the overall efficiency of heat transfer and reducing thermal resistance
Data Source
AI summary
A light-emitting device comprises a casing including an upper surface portion having one or more first through holes, and a front surface portion having an opening; a transparent member that closes off the one or more first through holes; one or more light-emitting elements that face the one or more first through holes, respectively, within the casing; and a lid member provided so as to close off the opening, wherein the casing is integrally formed using one material.