Integrated LED Control Circuit for Compact Individual Addressing
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Solution Overview
Problem
There is a need for a cost-effective and compact packaging solution for LEDs and associated control devices that allows for efficient control and spacing of multiple LEDs in a compact design.
Innovation Solution
The solution involves integrating LED packages with individual control circuits, where each LED is bonded over a respective control circuit, with control lines that are thin and only carry gate current, allowing for a series or parallel configuration of LEDs, enabling individual control and compact arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If LEDs are mounted on separate substrates with control circuitry, then individual LED control is achieved, but lateral space requirements increase
Solution Approach 1:
The patent combines multiple previously separate components (LED die, control circuitry, substrate) into a single integrated LED package. The control circuitry is integrated directly onto the same substrate as the LED die, eliminating the need for separate substrates and reducing lateral space while maintaining individual LED control capability
Solution Approach 2:
The patent implements a nested structure where the LED die is mounted on a substrate that contains embedded control circuitry. The control circuitry is nested within the same package structure as the LED, with control lines routed through the substrate to reach the LED terminals, creating a compact hierarchical arrangement
2Ease of operation
If multiple discrete LED packages with control devices are used, then individual LED control is possible, but device complexity increases
Solution Approach 1:
The patent merges the LED die and control circuitry into a single integrated package, reducing the number of discrete components from multiple separate packages to one unified device. This integration simplifies the overall system architecture while preserving individual LED control functionality
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mechanical support for the LED die, provides electrical interconnection between the LED terminals and control circuitry, and integrates the control circuitry itself. This multi-functionality reduces the need for separate components and simplifies the overall device structure
Data Source
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AI summary
An LED circuit (40) comprises integrated circuit LEDs (50) each mounted over a respective LED control circuit (42). The LED control circuits (42) are electrically connected together to by the integrated circuit to define a string of LED control circuits, each having at least one control line (44) leading to the circuit. This provides a compact circuit of multiple LEDs with individual control of the LEDs.