Integrated LED Driver IC Substrate for Compact Thermal Management
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Solution Overview
Problem
Existing light emitting devices, particularly semiconductor-based LEDs, face challenges in miniaturization and efficient heat dissipation due to separate peripheral circuits, which hinder the development of slimmer and more efficient illumination devices.
Innovation Solution
Integration of a driver IC, controller IC, and power IC within a silicon semiconductive substrate, along with a heat dissipating unit and conductive via, to form a compact light emitting device that adjusts current and facilitates efficient heat dissipation, while reducing the size of the device and eliminating the need for external wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If separate peripheral circuits are used to drive LEDs, then the device can be manufactured with existing technologies, but the device size increases and heat dissipation becomes inefficient
Solution Approach 1:
The patent merges the driver IC, controller IC, power IC, and heat dissipating unit into a single integrated substrate structure. This consolidation eliminates the need for separate peripheral circuits and external wiring, directly reducing device size while maintaining manufacturing feasibility through integrated circuit technology.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mounting platform for light emitting elements, houses the driver IC for current control, contains the controller IC for signal processing, provides power management through the power IC, and functions as a heat dissipating unit. This multi-functionality reduces the overall device volume by eliminating the need for separate components for each function.
2Reliability
If external wiring is used to connect peripheral circuits, then the device can be assembled with modular components, but the device size increases and reliability decreases
Solution Approach 1:
The patent integrates all circuit components (driver IC, controller IC, power IC) and the heat dissipating unit onto a single substrate, eliminating external wiring connections. This integration removes potential failure points from wire bonds and solder joints, thereby improving device reliability while maintaining ease of manufacture through standardized integrated circuit fabrication processes.
3Volume of moving object
If the driver IC is integrated within the substrate, then the device size is reduced, but the heat dissipation challenge increases
Solution Approach 1:
The patent combines the driver IC with the heat dissipating unit into a single integrated structure on the substrate. The driver IC is positioned to utilize the heat dissipating unit's thermal pathways, allowing heat generated by the LED and driver circuitry to be efficiently conducted away through the substrate's thermal management design, thus resolving the heat dissipation challenge while maintaining compact size.
4Volume of moving object
If multiple ICs are integrated within the substrate, then the device achieves compact size, but the manufacturing precision requirement increases
Solution Approach 1:
The patent integrates the driver IC, controller IC, and power IC onto a single substrate using standard integrated circuit fabrication techniques. This approach maintains manufacturing precision by utilizing established semiconductor manufacturing processes that can accurately position and connect multiple IC components on a unified substrate, avoiding the need for high-precision manual placement while achieving compact device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated structure results in a compact, efficient, and reliable light emitting device with improved heat dissipation and reduced size, enhancing the reliability and light extraction efficiency of LEDs.
Implementation Method 1
a light emitting element mounted on the first main face of the substrate; and a driver integrated circuit (IC) formed in an area corresponding to a lower side of the light emitting element within the substrate, and adjusting the amount of current applied to the light emitting element
Implementation Method 2
a heat dissipating unit (or heat sinking unit) disposed at a lower side of the light emitting element such that it penetrate the substrate
Implementation Method 3
a conductive via extending from the first main face to the second main face and made of a material different from that of the substrate
Data Source
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AI summary
A light emitting device (100) includes: a substrate (102) having opposed first and second main faces; a light emitting element (101) mounted on the first main face of the substrate; and a driver integrated circuit (IC) (103) formed in an area corresponding to a lower side of the light emitting element within the substrate, and adjusting the amount of current applied to the light emitting element. Since the circuit (103) provided to drive a light emitting diode (101) (LED) is integrated within the substrate (102), a compact light emitting device having an integrated structure can be obtained.