3D Integrated LED Driver Architecture for Compact Packaging
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Solution Overview
Problem
Existing LED driver systems face challenges in minimizing form factor and increasing packing density while optimizing performance, which is hindered by packaging-related volume overhead and the need for holistic system design.
Innovation Solution
A three-dimensional integrated LED driver system is developed, incorporating tight integration of components such as capacitors, transformers, and control devices, using a wafer level substrate with multi-layer buildup processes and embedded metal layers to minimize volume and maximize performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LED drivers are integrated to minimize form factor, then volume and packing density are improved, but manufacturing complexity and design challenges increase
Solution Approach 1:
The patent combines multiple LED driver components including capacitors, transformers, and control devices into a single integrated circuit package. This merging of previously separate components into one unified device reduces the overall form factor while managing the inherent complexity through systematic integration architecture.
Solution Approach 2:
The integrated LED driver system employs a nested structure where smaller functional blocks (such as capacitor arrays, transformer windings, and control logic) are embedded within larger package structures. This nesting approach maximizes packing density by efficiently utilizing three-dimensional space within the integrated device.
2Volume of moving object
If components are packed at higher density, then volume overhead is reduced, but heat dissipation and electrical interference challenges worsen
Solution Approach 1:
The patent implements local quality variations within the integrated device by creating specialized zones with different thermal and electrical characteristics. High-density capacitor regions are separated from high-current transformer windings by dielectric barriers and thermal management structures, allowing each region to be optimized for its specific function while managing heat and interference locally.
Solution Approach 2:
The integrated structure introduces intermediary elements such as dielectric layers, thermal vias, and shielding structures between densely packed components. These intermediaries act as buffers that manage heat transfer and electrical interference, enabling high-density packaging without compromising thermal performance or electrical isolation.
3Quantity of substance
If multi-layer buildup processes are used, then packing density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary alignment structures and registration features that are formed during earlier fabrication stages. These pre-established reference structures guide subsequent layer deposition and bonding processes, ensuring precise alignment across multiple fabrication steps without requiring extremely tight process control at each individual stage.
Solution Approach 2:
The manufacturing process utilizes parameter changes such as controlled thermal expansion, stress-induced alignment, and electrostatic positioning during layer assembly. By leveraging these physical parameter changes, the patent achieves high packing density with acceptable manufacturing precision tolerances through self-aligning mechanisms rather than relying solely on mechanical precision.
Data Source
AI summary
A method includes forming one or more capacitors over a substrate. The method also includes forming a transformer at least partially over the substrate. The transformer is adjacent to at least one of the one or more capacitors. At least a portion of the transformer is formed at a same level over the substrate as the one or more capacitors. The method further includes coupling the one or more capacitors and the transformer to at least one embedded integrated circuit die. The one or more capacitors, the transformer, and the at least one embedded integrated circuit die form at least part of a light emitting diode (LED) driver.