Integrated LED Epitaxial Structure with Electroplated Pads
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Solution Overview
Problem
Conventional LED lighting package methods require complex processes and are limited by insufficient package welding, electrode shading, and poor wiring stability, especially in high-voltage applications.
Innovation Solution
An integrated LED light-emitting device with a thick electrode pad layer and insulating layers to form a connection circuit plane with no height difference, allowing for direct surface-mounted packaging and improved electrical isolation, enabling series, parallel, or series-parallel connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-chip structure with die bonding and wire bonding is used, then LED lighting function is achieved, but packaging process becomes complex and welding reliability is insufficient
Solution Approach 1:
The patent merges multiple LED chips and their interconnections into a single integrated epitaxial unit grown on one substrate. Multiple LED light-emitting units are formed simultaneously on the same substrate with built-in electrical connections, eliminating the need for separate die bonding and wire bonding processes. This integration approach resolves the contradiction by simplifying the packaging process while improving welding reliability through monolithic growth.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the complete LED structure with all necessary electrical connections during the epitaxial growth process itself. The substrate is prepared with multiple LED units and their interconnections before any packaging operations, so that subsequent packaging becomes a simple mounting process rather than a complex assembly process. This preliminary integration resolves the technical contradiction.
2Device complexity
If high-voltage LED chip concept is used, then simplified packaging is achieved, but electrode shading and wiring stability problems occur
Solution Approach 1:
The patent transitions from planar electrode connections to three-dimensional vertical connections through the substrate thickness. Electrical connections are established through the substrate in the vertical dimension rather than relying on surface-level wire bonding, improving wiring stability. The thick substrate acts as a mechanical support and electrical interconnection medium, resolving the contradiction between simplified packaging and wiring reliability.
Solution Approach 2:
The substrate serves as an intermediary element that provides both mechanical support and electrical interconnection between multiple LED units. Instead of direct wire bonding between chips, the substrate mediates the electrical connections through its thickness, ensuring stable wiring while maintaining packaging simplicity. This intermediary approach resolves the technical contradiction.
3Strength
If thick electrode pad layer is used to support epitaxial film, then mechanical strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The electrode pad layer is formed through electroplating, a self-regulating process where the metal deposits automatically to a controlled thickness based on electrical parameters. The plating process inherently controls the thickness uniformity through current density distribution and time control, eliminating the need for complex mechanical thickness control. This self-service approach resolves the contradiction between obtaining sufficient strength and maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances electro-optical efficiency, reduces packaging material costs, improves heat dissipation, and extends the service life of LED devices by simplifying the fabrication process and avoiding circuit failures.
Implementation Method 1
the electrode pad layer is formed through electroplating
Data Source
AI summary
A light-emitting diode (LED) includes: an epitaxial structure having an upper and a lower surface, wherein the upper surface comprises a light-emitting surface; at least one insulating layer over the lower surface; and an electrode pad layer over the at least one insulating layer; wherein: the electrode pad layer comprises a P electrode region and an N electrode region; and the at least one insulating layer is configured to adjust a distribution of the P and N electrode regions over the electrode pad layer.