Integrated LED Lighting Unit with Overmoulded Heatsink

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Solution Overview

Problem

High-power LEDs require a heat sink for reliability and longevity, but existing solutions necessitate expert knowledge for replacement due to precise placement and thermal interface handling, making it difficult for non-technical users to install or replace LED modules.

Innovation Solution

A self-contained LED lighting unit with an integrated heatsink and overmould that encases the electrical interface, allowing for easy installation and replacement without additional heat-dissipating components, using a thermally conductive material like aluminum or copper for the heatsink and a suitable plastic overmould to provide a robust and thermally efficient enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the LED module is mounted separately to a heatsink component using thermal interface material, then heat dissipation is achieved, but the replacement requires expert knowledge and precise placement

Engineering Contradiction:
Improveheat dissipationVSAvoidinstallation complexity
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent combines the LED module and heatsink into a single integrated unit where the heatsink is built into the LED module housing. This merging eliminates the need for separate mounting and thermal interface materials, allowing users to simply replace the entire module without requiring expert knowledge for precise placement or thermal interface handling.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the lighting system into modular LED lighting units that can be independently replaced. Each unit is a self-contained module with integrated heat dissipation, allowing the faulty module to be removed and replaced as a complete unit without affecting other components or requiring complex assembly procedures.

Inventive Principle:
Principle #1Segmentation

2Temperature

If the LED module is mounted separately to a heatsink component, then heat dissipation is achieved, but technical expertise is required for correct mounting

Engineering Contradiction:
Improveheat dissipationVSAvoidmounting precision
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heatsink is integrated into the LED module housing as a built-in component rather than a separate element. This ensures that heat dissipation capability is permanently attached to the LED module, eliminating risks of improper mounting or insufficient thermal contact that would occur with separate assembly. The reliability of heat dissipation is guaranteed by the integrated design.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If thermal interface material is used to connect LED module to heatsink, then thermal contact is achieved, but handling requires expert knowledge

Engineering Contradiction:
Improvethermal contactVSAvoidapplication complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The integrated design merges the LED module and heatsink into a single manufactured unit with pre-established thermal pathways. This eliminates the need for users to handle and apply thermal interface materials, as the thermal connection is permanently established during manufacturing. The complexity of thermal interface application is transferred from the installation phase to the manufacturing phase.

Inventive Principle:
Principle #5Merging (Combining)

4Illumination intensity

If precise placement of LED module on heatsink is required, then beam shape accuracy is maintained, but installation becomes impossible for ordinary users

Engineering Contradiction:
Improvebeam shape accuracyVSAvoiduser accessibility
Core Design Contradiction:
Illumination intensityVSEase of operation

Solution Approach 1:

The LED module and heatsink are merged into a single integrated unit with pre-established geometric alignment. This eliminates the need for users to perform precise placement operations, as the beam-shaping geometry is permanently fixed during manufacturing. Ordinary users can simply install the complete module without requiring expertise in alignment or placement precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The precise placement and alignment are performed during the manufacturing phase rather than during installation. The LED module is pre-positioned and fixed to the heatsink with the correct geometry for optimal beam shape. This preliminary action transfers the precision requirement from the installation phase to the manufacturing phase, making the product user-friendly while maintaining performance.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables easy installation and replacement of LED lighting units by non-experts, reducing costs associated with technical expertise and ensuring efficient heat dissipation, while maintaining precise placement and light emission integrity.

Implementation Method 1

High-power LEDs become very hot in use, and some kind of heat sink is always required to remove the heat in order to ensure high reliability and a long lifetime

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10935202B2LED lighting unit
Publication Date: 2021.03.02 LUMILEDS SINGAPORE PTE LTD
  • US10935202B2 patent drawing
  • US10935202B2 patent drawing
  • US10935202B2 patent drawing

AI summary

The invention describes a LED lighting unit comprising a heatsink; an LED module mounted onto the heatsink, which LED module comprises a carrier, a number of LED dies mounted on the carrier, and LED electrode contacts formed on the carrier; an overmould formed to encase the heatsink and to expose the mounting surface region of the heatsink upon which the LED module is mounted; and an electrical interface also encased in the overmould and arranged to electrically connect the LED module to a power supply. The invention further describes a method of manufacturing such an LED lighting unit.