Integrated LED Submount with Switch-Mode Power Supply
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Solution Overview
Problem
Current LED packages require multiple separate electronic components for powering and controlling LED dies, leading to inefficiencies, reliability issues, and increased complexity, particularly due to the need for power factor correction in LED lighting systems which can cause distortions in power distribution and waste energy.
Innovation Solution
Integration of an electronic component within the LED package, such as a switch-mode power supply, processor, and power-factor-control circuit, to control the intensity and apparent intensity of the LED die, enabling efficient power management and communication, thereby simplifying the system and improving power factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple separate electronic components are used for powering and controlling LED dies, then the system can provide basic functionality, but the device complexity increases and reliability decreases
Solution Approach 1:
The patent integrates multiple separate electronic components (power supply, control circuitry, communication interfaces) into a single integrated circuit board within the LED package. This merging of components reduces the overall number of discrete parts, simplifies system architecture, and improves reliability by reducing connection points and potential failure modes between separate components.
Solution Approach 2:
The integrated circuit board performs multiple functions simultaneously: it provides power management, controls LED intensity, enables communication between LED dies, and implements power factor correction. This multi-functionality eliminates the need for separate dedicated components for each function, thereby reducing device complexity while maintaining comprehensive system capability.
2Loss of energy
If switching power supplies are used in LED lighting systems, then power conversion efficiency improves, but power factor decreases and causes current distortions
Solution Approach 1:
The patent incorporates power factor correction circuitry that converts the harmful effect of low power factor and current distortion into a benefit by actively compensating for these issues. The correction circuitry processes the distorted current from the switching power supply and outputs a corrected, sinusoidal current waveform, thereby eliminating the harmful effects while maintaining the efficiency benefits of switching power conversion.
3Loss of energy
If power factor correction is implemented in LED lighting systems, then energy waste is reduced, but the device complexity increases
Solution Approach 1:
The power factor correction circuitry is integrated into the same circuit board as other control functions, sharing common components and infrastructure. This integration approach reduces the complexity increase that would result from adding separate power factor correction equipment, as the correction functionality is combined with existing control circuitry rather than being implemented as a standalone system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration enhances the efficiency and reliability of LED lighting systems by reducing energy waste, improving power factor, and simplifying the system architecture, while allowing for controlled intensity and communication capabilities.
Implementation Method 1
The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.
Implementation Method 2
LED packages have been developed that include an LED die and a submount that includes a diode
Data Source
AI summary
Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.