Integrated Lens Structures on Silicon Backplane Wafer
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Solution Overview
Problem
Conventional processes for manufacturing imaging sensors, such as CCD and CMOS, face challenges in reducing device size and complexity due to material and process incompatibilities, leading to complex and cumbersome manufacturing techniques.
Innovation Solution
A method for manufacturing an integrated lens structure for image sensing devices, involving a silicon wafer with photo diode regions, an interlayer dielectric layer, a shielding layer, and silicon dioxide bearing lens structures, which are compatible with conventional technology and equipment, allowing for higher device yields and improved process capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional processes are used for manufacturing imaging sensors, then material and process incompatibilities are avoided, but device size reduction and complexity reduction become challenging
Solution Approach 1:
The patent merges previously separate manufacturing processes for color filters and micro lenses into a single integrated process. Both structures are formed simultaneously on the same silicon backplane using compatible materials and processes, eliminating the need for separate assembly steps and reducing overall manufacturing complexity.
Solution Approach 2:
The invention uses a universal silicon-based process platform that can manufacture both color filters and micro lenses using the same materials and equipment. This multi-functional approach allows a single fabrication line to produce multiple sensor components without requiring specialized processes for each component type.
2Manufacturing precision
If micro lenses are stacked onto color filters using complex techniques, then imaging performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of color filters and micro lenses into a single simultaneous process rather than sequential assembly. Both structures are patterned and formed in the same fabrication sequence, ensuring precise alignment while eliminating complex stacking and assembly operations.
Solution Approach 2:
The method performs preliminary patterning and formation of both color filter and micro lens structures during the same fabrication stage. By preparing both components simultaneously with pre-coordinated process steps, the invention achieves precise alignment without requiring complex post-fabrication assembly techniques.
3Productivity
If device feature size is reduced to increase circuit density, then more devices can be fabricated per wafer, but process limitations are reached
Solution Approach 1:
The patent employs parameter changes in the fabrication process, including adjusted etching conditions, deposition parameters, and photolithography settings, to successfully manufacture smaller feature sizes. These optimized parameters enable the process to exceed conventional limits and achieve higher device density while maintaining manufacturing precision.
Data Source
AI summary
A method for forming image sensors includes providing a substrate and forming a plurality of photo diode regions, each of the photo diode regions being spatially disposed on the substrate. The method also includes forming an interlayer dielectric layer overlying the plurality of photo diode regions, forming a shielding layer formed overlying the interlayer dielectric layer, and applying a silicon dioxide bearing material overlying the shielding layer. The method further includes etching portions of the silicon dioxide bearing material to form a plurality of first lens structures, and continuing to form each of the plurality of first lens structures to provide a plurality of finished lens structures.