Integrated LGA Socket and Card Edge Connector for Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional circuit packaging designs face limitations in signal transmission due to signal latency and attenuation in printed circuit board (PCB) traces as processor performance and I/O signal frequencies increase, necessitating a more direct connection between circuit cards.
Innovation Solution
Integration of a card edge connector with a land grid array (LGA) socket to provide a more direct electrical connection between circuit cards, utilizing multiple rows of electrical contacts and alignment elements for secure and efficient communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals are transmitted through PCB traces, then electrical connection between circuit cards is achieved, but signal latency and attenuation increase at higher frequencies
Solution Approach 1:
The patent merges the LGA socket and card edge connector into a single integrated assembly. The socket housing contains both the cavity for seating the integrated circuit and the card edge connector with multiple rows of electrical contacts. This integration eliminates the need for separate connection components and reduces the overall signal path length through the PCB, thereby reducing signal latency and maintaining signal integrity at higher frequencies.
Solution Approach 2:
The card edge connector extends the electrical connection in a different spatial dimension by providing multiple rows of contacts (first row, second row, third row, fourth row) that accept card edge contacts. This multi-row configuration creates additional direct electrical pathways that bypass lengthy PCB traces, reducing signal attenuation and latency while maintaining reliable high-frequency transmission.
2Reliability
If PCB traces are used for signal transmission, then electrical connection is established, but trace length limitations restrict higher frequency signal transmission
Solution Approach 1:
The patent merges the LGA socket and card edge connector into a single integrated assembly. The socket housing contains both the cavity for seating the integrated circuit and the card edge connector with multiple rows of electrical contacts. This integration eliminates the need for separate connection components and reduces the overall signal path length through the PCB, thereby reducing signal latency and maintaining signal integrity at higher frequencies.
Solution Approach 2:
The integrated electromechanical assembly acts as an intermediary component that provides direct electrical contact between circuit cards. The multiple rows of electrical contacts in the card edge connector portion create short, direct signal pathways that bypass lengthy PCB traces, effectively mediating the connection to maintain signal strength for high-frequency transmission.
3Loss of time
If a direct connection between circuit cards is implemented, then signal latency is reduced, but device complexity increases
Solution Approach 1:
The patent merges the LGA socket and card edge connector into a single integrated assembly. The socket housing contains both the cavity for seating the integrated circuit and the card edge connector with multiple rows of electrical contacts. This integration eliminates the need for separate connection components and reduces the overall signal path length through the PCB, thereby reducing signal latency and maintaining signal integrity at higher frequencies.
Solution Approach 2:
The integrated electromechanical assembly performs multiple functions within a single component: it provides both the LGA socket function for seating integrated circuits and the card edge connector function for direct card-to-card communication. The socket housing serves as both the structural support for the integrated circuit and the mounting structure for the card edge connector, reducing overall system complexity despite the enhanced functionality.
Data Source
AI summary
An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.


