Integrated LiDAR Light Receiving and Emitting Device with Control Circuit Wafer
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Solution Overview
Problem
Current LiDAR technologies face limitations in cost due to mechanical precision parts and durability issues, particularly with independent light emitting and receiving units that require complex alignment and additional processing steps, leading to increased device size and reduced lifespan.
Innovation Solution
An integrated light receiving and emitting device is developed, where both units are vertically formed on a single semiconductor substrate using wafer patterning, combined with a control circuit wafer through vertical bonding, allowing for a single chip structure with on-chip connections and optional lens integration, reducing device size and simplifying manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light emitting unit and light receiving unit are independently provided in a device, then light alignment can be achieved, but device complexity increases due to additional combining process with control circuit and lens system
Solution Approach 1:
The patent merges the light emitting unit and light receiving unit into a single integrated device structure, where both units are disposed on the same substrate. This integration eliminates the need for separate combining processes with control circuits and reduces the number of discrete components requiring alignment, thereby simplifying the overall manufacturing process while maintaining light alignment capability through the unified structural design.
2Adaptability or versatility
If light emitting unit and light receiving unit are independently provided, then functional separation is achieved, but space occupied by the entire device increases
Solution Approach 1:
The patent employs a nested arrangement where the light emitting unit and light receiving unit are disposed in close proximity on the same substrate, with their optical axes aligned. This compact nesting reduces the overall device footprint while maintaining functional separation, as each unit performs its dedicated function within the integrated structure without requiring additional space for separate housing and alignment mechanisms.
3Reliability
If wire bonding process is used to connect device with control circuit, then electrical connection is achieved, but space occupied by the device increases
Solution Approach 1:
The patent extracts the control circuit from a separate component and integrates it directly onto the same substrate as the light emitting and receiving units. This extraction of the control circuit from external placement to internal integration eliminates the need for wire bonding processes and associated connection space, while maintaining reliable electrical connections through direct substrate routing and reduced interconnect length.
4Ease of operation
If mechanical precision parts are used in LiDAR, then directional control of laser beam is achieved, but manufacturing price increases
Solution Approach 1:
The patent replaces mechanical precision parts such as motors and mirrors with a fixed non-mechanical LiDAR design. The directional control function is achieved through the geometric arrangement and optical axis alignment of the integrated light emitting and receiving units on the substrate, eliminating moving mechanical components. This substitution maintains operational capability while significantly reducing manufacturing complexity and cost by removing precision mechanical assembly requirements.
Data Source
AI summary
The present disclosure relates to an integrated light receiving and emitting device combined with a control circuit wafer and a manufacturing method thereof. The integrated light receiving and emitting device combined with a control circuit wafer according to an exemplary embodiment of the present disclosure includes: a light receiving and emitting unit which has an integrated wafer structure in which a light emitting unit and a light receiving unit are vertically formed on one surface of a single semiconductor substrate by wafer patterning and a control circuit wafer which is combined with the light receiving and emitting unit by vertical bonding to be operated as a single chip device, in which the control circuit wafer is connected to the light emitting unit and the light receiving unit.