Integrated Light Driver and Optical Sensor Circuit Module
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Solution Overview
Problem
Conventional scanning chassis designs face challenges in minimizing space due to the separate arrangement of light driver and optical sensor circuit modules, which becomes impractical as the chassis size decreases.
Innovation Solution
Integrating the optical sensor and light driver on a single printed circuit board, allowing them to be mounted on the same plane, thereby reducing the overall space required for the circuit module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light driver circuit module and optical sensor circuit module are arranged separately on different printed circuit boards, then the ease of manufacture and assembly is improved, but the volume of the scanning chassis increases
Solution Approach 1:
The patent merges the light driver circuit module and optical sensor circuit module into a single integrated circuit module. The light driver circuit and optical sensor circuit are mounted on the same printed circuit board, eliminating the need for separate boards and reducing the overall volume of the scanning chassis while maintaining ease of manufacture through standardized integration
2Volume of stationary object
If the light driver circuit module and optical sensor circuit module are integrated on a single printed circuit board, then the volume of the scanning chassis is reduced, but the device complexity increases
Solution Approach 1:
The integrated circuit module is segmented into distinct functional regions: the light driver circuit section and the optical sensor circuit section. This segmentation allows for modular design and assembly, reducing the complexity of integration while maintaining compact form factor. Each section can be designed and tested independently before final assembly
3Area of stationary object
If the light driver and optical sensor are mounted on the same plane, then the space utilization is optimized, but the heat dissipation becomes more challenging
Solution Approach 1:
The printed circuit board is designed with localized thermal management features. Heat dissipation structures such as thermal vias, heat sinks, or copper pours are strategically placed in high-density mounting regions where heat generation is concentrated. This allows for effective heat dissipation in specific areas without compromising the overall compact design and space utilization
Data Source
AI summary
A circuit module integrating a light driver and an optical scanner is capable of sensing an image of a document and driving a light source. The circuit module comprises a printed circuit board, an optical sensor and a light driver. Both the optical sensor and the light driver are mounted on and electrically connected with the printed circuit board. The optical sensor is capable of sensing the image and the light driver is capable of driving the light source.