Integrated Light-Emitting Pixel Arrays via Bonding
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Solution Overview
Problem
The manufacturing complexity of LED arrays is high due to the need for large supporting substrates with I/O pads and high power consumption of driver circuitry, which reduces assembly yield and increases manufacturing costs.
Innovation Solution
The method involves bonding different components on separate substrates to form integrated light-emitting pixel arrays, using low-temperature bonding and patterning to create active-matrix light-emitting pixels with conductive coupling to pixel circuits, and depositing phosphor or quantum-dot materials for multi-color displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED arrays are manufactured by depositing materials on a supporting substrate with I/O pads around the edges, then the array can be formed, but the supporting substrate size becomes larger than the array size, reducing assembly yield
Solution Approach 1:
The invention segments the LED array manufacturing by dividing it into multiple smaller sub-arrays that are formed on separate supporting substrates. These sub-arrays are then assembled together to create the final large-scale LED display. This segmentation allows each individual substrate to be smaller and more manageable, improving assembly yield while achieving the desired large overall display area.
2Ease of operation
If driver circuitry is integrated with LED arrays, then the display can be controlled, but power consumption increases and manufacturing complexity increases
Solution Approach 1:
The driver circuitry is segmented and distributed across multiple independent control units, each managing a portion of the LED array. This allows for modular manufacturing where each module can be produced and tested separately, reducing overall manufacturing complexity while maintaining full display control capability through coordinated operation of the distributed drivers.
Solution Approach 2:
The invention introduces controller units as intermediary components that mediate between the control system and the LED array. These controllers simplify the direct interface requirements, reducing manufacturing complexity by providing standardized communication protocols and control interfaces while enabling sophisticated display control functions.
3Area of moving object
If contact pads are made very small to increase array size, then the array density increases, but assembly yield greatly reduces
Solution Approach 1:
By segmenting the LED array into multiple sub-arrays on separate substrates, each substrate can have appropriately sized contact pads that are large enough to ensure reliable assembly. The segmentation eliminates the need for extremely small contact pads that would be required if a single large substrate were used, thereby maintaining high assembly yield while achieving the desired overall array size through composition of multiple sub-arrays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies manufacturing, improves efficiency, and reduces costs by eliminating the need for large substrates and high power consumption, while enabling high-resolution, low-power, and flexible display systems with fast response times.
Implementation Method 1
forming a plurality of layers on a first substrate to form a light emitting structure
Implementation Method 2
depositing phosphor or quantum-dot materials for multi-color displays
Data Source
AI summary
Integrated active-matrix light emitting pixel arrays based displays are provided. An example integrated device includes a backplane including pixel circuits conductively coupled to an array of light-emitting elements through intermediate conductive layers to form an array of active-matrix light-emitting pixels and a transparent conductive layer on the array of the light-emitting elements. Each of the light-emitting elements includes one or more quantum well semiconductor layers between a first contact electrode and a second contact electrode, and the first contact electrodes of the light-emitting elements is respectively bonded and conductively coupled to the pixel circuits in the backplane via the respective intermediate conductive layers. The transparent conductive layer is in contact with the second contact electrodes of the light-emitting elements to form a common electrode of the light-emitting elements, and a top surface of each of the second contact electrodes is fully in contact with the transparent conductive layer.