Integrated Light Emitting Receiving Device Assembly
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Solution Overview
Problem
Existing techniques fail to integrate light emitting and receiving devices as a single, compact unit, making it difficult to reduce the size and thickness of the device layer and efficiently transfer them to a mount substrate.
Innovation Solution
A light emitting device-light receiving device assembly is created with a mount substrate having raised bases for anchoring both devices, allowing for precise mounting and integration, enabling the devices to be transferred and assembled as an integral unit with reduced size and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light emitting device and light receiving device are laminated via base materials as separate devices, then the device structure is established, but the size and thickness of the device layer cannot be reduced
Solution Approach 1:
The patent combines the light emitting device and light receiving device into a single integrated device structure. The light emitting device is formed on a first substrate, and the light receiving device is formed on a second substrate, which is then bonded to the first substrate. This merging eliminates the need for separate base materials and reduces the overall device layer thickness while maintaining functional integrity.
Solution Approach 2:
The patent implements a nested structure where the light receiving device is positioned within the vertical space above the light emitting device, with the light passage portion allowing light transmission between them. This nesting approach minimizes the vertical thickness of the device layer while maintaining the necessary optical path and functional separation between emitting and receiving components.
2Ease of manufacture
If devices are transferred to mount substrate using existing transfer techniques, then transfer is achieved, but it is extremely difficult to transfer the optical transmitter/receiver as an integral unit
Solution Approach 1:
The patent segments the integrated optical device into two main components: the light emitting device on the first substrate and the light receiving device on the second substrate. This segmentation allows each component to be transferred independently to the mount substrate using standard transfer techniques, avoiding the complexity of transferring the entire integrated unit as a single piece while maintaining their functional integration through precise alignment and bonding.
Solution Approach 2:
The patent performs preliminary bonding between the first and second substrates before the transfer process. This preliminary action creates a stable integrated structure that can be handled and transferred together, ensuring that the relative positions of the light emitting and receiving devices are maintained during transfer, thereby improving transfer success rate and device reliability.
Data Source
AI summary
A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.