Integrated Lighting Device Thermal and Wireless Management
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Solution Overview
Problem
Connected LED lamps require a high number of connections between light generating and communication functionality components, and face challenges in ensuring a sufficient ground plane for antennas, leading to inefficiencies in thermal management and wireless communication performance.
Innovation Solution
A lighting device with a carrier substrate that integrates both light-emitting and communication modules, where the light-emitting module overlies a heat-transferring element for efficient thermal management and the communication module does not overlie the heat-transferring element to maintain wireless communication performance, reducing the need for separate components and connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the light-emitting module and communication module are provided in separate components, then thermal management performance is improved, but the number of connections between components increases
Solution Approach 1:
The patent combines the light-emitting module and communication module into a single integrated module, eliminating the need for multiple connections between separate components while maintaining thermal management performance through the shared heat-transferring element
Solution Approach 2:
The integrated module serves multiple functions simultaneously - light emission, wireless communication, and thermal management - reducing system complexity while maintaining the thermal management benefits of separate component design
2Reliability
If the antenna is arranged distinct from and at a distance from metal parts, then antenna performance is improved, but the ground plane area for the antenna is reduced
Solution Approach 1:
The patent creates different spatial zones within the integrated module - the communication module region maintains distance from metal parts for optimal antenna performance, while the light-emitting module region utilizes the heat-transferring element for thermal management, allowing each function to operate in its optimal local environment
3Temperature
If the light-emitting elements are placed on a metal core printed circuit board, then thermal management performance is improved, but the antenna performance deteriorates due to proximity with metal parts
Solution Approach 1:
The patent segments the integrated module into distinct functional regions - the light-emitting module is positioned over the heat-transferring element for optimal thermal management, while the communication module is positioned away from metal parts for optimal antenna performance, allowing both requirements to be satisfied simultaneously in different spatial zones
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high efficiency in thermal management and good wireless communication performance while minimizing the number of connections needed, enhancing overall device performance.
Implementation Method 1
a relatively high amount of heat, or thermal energy, generated by the light-emitting module may be transported away from the light-emitting module by means of heat transfer from the light-emitting module via the heat-transferring element
Data Source
Figure 1~2
Figure 3
AI summary
A lighting device (1) is disclosed, comprising a carrier substrate (4) and a heat-transferring element (5). The carrier substrate (4) includes at least a first region (6) and a second region (8). The first region (6) comprises a light-emitting module (7). The second region (8) comprises a communication module (9), which is configured for wireless communication. The heat-transferring element (5) connected with the carrier substrate (4). The carrier substrate (4) partly overlies the heat-transferring element (5) such that at least a part or portion of the first region (6) of the carrier substrate (4) overlies the heat-transferring element (5) and at least a part or portion of the second region (8) of the carrier substrate (4) does not overlie the heat-transferring element (5).