Integrated Liquid-Cooled Heat Dissipation System for Electronic Equipment

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Solution Overview

Problem

Conventional liquid-cooled heat dissipation systems for electronic equipment suffer from inefficiencies in heat dissipation, structural compactness, and a high risk of liquid leakage due to dispersed component arrangements and the use of pipes for connection.

Innovation Solution

An integrated liquid-cooled heat dissipation system is developed, where a heat dissipation device, pumping device, and water reservoir are integrated and interconnected, with the water reservoir partitioned for improved sealing and the pumping device arranged on the heat dissipation device, enhancing efficiency and reducing space occupation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional dispersed liquid-cooled heat dissipation systems are used, then components can be assembled separately, but the structure becomes incompact and liquid leakage risk increases

Engineering Contradiction:

Improvecomponent assemblyVSAvoidliquid leakage risk

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent integrates the water reservoir, heat dissipation device, and pumping device into a single integrated liquid-cooled heat dissipation system. The water reservoir is formed as an integral part of the heat dissipation device, and the pumping device is mounted directly on the heat dissipation device, eliminating multiple connection joints and reducing liquid leakage risk while maintaining ease of manufacture through modular integration.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If pipes are used to connect components, then assembly is flexible, but the structure becomes complex and space occupation increases

Engineering Contradiction:

Improveassembly flexibilityVSAvoidstructural complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent eliminates the need for separate connection pipes by integrating the water reservoir directly into the heat dissipation device structure. The pumping device is mounted directly on the heat dissipation device, creating a compact integrated system that reduces structural complexity while maintaining assembly flexibility through modular design.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If conventional extruded aluminum radiator is used, then manufacturing is simple, but heat dissipation efficiency is insufficient for high heat flux

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent employs a heat dissipation device with composite structure including copper water channels and aluminum fins, combining the high thermal conductivity of copper for heat absorption with the high surface area and oxidation resistance of aluminum for heat dissipation. This composite structure significantly enhances heat dissipation efficiency while maintaining manufacturing feasibility through established extrusion and bonding processes.

Inventive Principle:

Principle #40Composite materials

4Productivity

If liquid-cooled system with multiple components is used, then heat dissipation capacity is sufficient, but the structure is incompact and cannot utilize limited space efficiently

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidspace occupation

Core Design Contradiction:

ProductivityVSVolume of moving object

Solution Approach 1:

The patent integrates the water reservoir, heat dissipation device, and pumping device into a single compact unit. The water reservoir is formed as an integral part of the heat dissipation device, and the pumping device is mounted directly on the heat dissipation device, eliminating the need for separate components and connection pipes, thereby significantly reducing overall volume while maintaining high heat dissipation capacity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated system achieves higher heat dissipation efficiency, reduces the risk of liquid leakage, and allows for customized heat management in electronic equipment with large heat dissipation capacities, while optimizing space usage and extending the service life of components.

Implementation Method 1

the liquid absorbs heat from the electronic device when flowing through the cold plate

Methodology Applied

Scientific EffectHeat absorption: Conduction (thermal)

Implementation Method 2

enters the fin radiator to dissipate the heat into the ambient

Methodology Applied

Scientific EffectHeat dissipation: Convection

Implementation Method 3

dissipate the heat into the ambient

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

under the driving of the pump, the liquid absorbs heat from the electronic device

Methodology Applied

Scientific EffectPumping: Pump

Data Source

PatentUS10750638B2Integrated liquid-cooled heat dissipation system

Publication Date: 2020.08.18 APALTEK DONGGUAN CO LTD

AI summary

An integrated liquid-cooled heat dissipation system includes a heat dissipation device, a pumping device, a water reservoir, and a heat absorption device. The heat dissipation device, the pumping device, the water reservoir, and the heat absorption device are integrated as a whole and interconnected with each other, a main body of the heat dissipation device is provided with the pumping device; the water reservoir is integratedly arranged on and connected to the heat dissipation device; and the heat absorption device is arranged on the water reservoir.