Integrated Liquid Cooling Module for Thin Electronic Devices
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Solution Overview
Problem
Conventional liquid cooling systems for electronic devices are bulky, prone to leakage, and have a short service life due to multiple components and piping issues, making them unsuitable for thin electronic devices and requiring frequent maintenance.
Innovation Solution
A liquid cooling module with a housing containing two chambers filled with working fluid, interconnected by an intercommunicating port and backflow port, driven by a pump with a stator and impeller, which reduces the number of components, minimizes leakage risk, and allows for pre-assembly, enhancing cooling efficiency and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid cooling systems use multiple components and piping assemblies, then cooling function is achieved, but device complexity increases and assembly becomes troublesome
Solution Approach 1:
The patent merges the heat absorbing unit, cooling unit, and pump into a single integrated liquid cooling module. The housing contains both the first chamber (heat absorbing) and second chamber (cooling) with working fluid, eliminating the need for separate piping assemblies to connect these components. This integration directly reduces device complexity while maintaining the complete cooling function.
Solution Approach 2:
The housing serves multiple functions simultaneously: it contains the working fluid, provides thermal conduction for heat absorption, houses the pump mechanism, and structures the cooling channels. This multi-functionality reduces the number of separate components needed, resolving the contradiction between achieving cooling function and reducing device complexity.
2Productivity
If conventional liquid cooling systems use piping assemblies, then fluid circulation is achieved, but leakage risk increases and assembly becomes time-consuming
Solution Approach 1:
The pump, heat absorbing unit, and cooling unit are merged into a single sealed housing, eliminating external piping assemblies that are prone to leakage. The working fluid circulates internally within the sealed chambers, dramatically reducing leakage risk while maintaining fluid circulation functionality.
Solution Approach 2:
The patent employs a pre-assembled, sealed liquid cooling module that can be replaced as a single unit. This approach eliminates the need for complex piping assembly and reduces leakage risks associated with multiple connection points, making the system more reliable and easier to maintain.
3Productivity
If conventional liquid cooling systems have multiple piping components, then fluid flow is achieved, but service life decreases due to evaporation and aging
Solution Approach 1:
The integrated housing design seals the working fluid within the first and second chambers, eliminating exposure to external environments that cause evaporation and aging. The pump draws fluid directly from the first chamber and returns it to the second chamber in a closed internal loop, extending service life by protecting the fluid from degradation.
4Reliability
If conventional liquid cooling systems are assembled with multiple components, then cooling coverage is achieved, but spatial requirements increase
Solution Approach 1:
The heat absorbing unit, cooling unit, and pump are merged into a compact single housing, significantly reducing the space required for assembly compared to separate components connected by piping. The integrated design maintains full cooling coverage while occupying less volume, making it suitable for thinned electronic devices.
Solution Approach 2:
The pump is received within the housing, and the first and second chambers are nested within the same housing structure. This nesting arrangement consolidates multiple functional elements into a single compact unit, reducing the overall spatial footprint while maintaining all necessary cooling functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat management with reduced spatial requirements, increased assembly efficiency, and extended service life by minimizing fluid evaporation and leakage, while maintaining high cooling efficiency for thin electronic devices.
Implementation Method 1
The pump includes a stator driving an impeller to rotate, driving the working fluid to flow from the first chamber through the intercommunicating port, the stator, and the impeller. The working fluid flows through the second chamber back into the first chamber via the backflow port.
Implementation Method 2
The heat absorbing unit 91 can abut a heat source Z of an electronic device. The temperature of the working fluid flowing through the heat absorbing unit 91 rises after absorbing heat
Implementation Method 3
The temperature of the working fluid flowing through the heat absorbing unit 91 rises after absorbing heat and is then reduced after passing through the cooling unit 92 which cools the working fluid.
Implementation Method 4
The liquid cooling module is disposed in the casing and is in thermal connection with the heat generating area via a heat absorbing zone of the housing
Data Source
AI summary
A liquid cooling module includes a housing having first and second chambers filled with a working fluid and intercommunicating with each other via an intercommunicating port and a backflow port. A pump is received in the housing and is aligned with the intercommunicating port. The pump includes a stator driving an impeller to rotate, driving the working fluid to flow from the first chamber through the intercommunicating port, the stator, and the impeller. The working fluid flows through the second chamber back into the first chamber via the backflow port. An electronic device includes a casing, an electric module received in the casing and including a heat generating area, and the liquid cooling module. The liquid cooling module is disposed in the casing and is in thermal connection with the heat generating area via a heat absorbing zone of the housing aligned with the first chamber or the second chamber.