Integrated Liquid Cooling Plate for Compact CPU Heat Dissipation

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Solution Overview

Problem

Conventional liquid-cooling heat dissipation systems for CPUs are bulky and difficult to assemble, which contradicts the trend towards compact computer designs due to their separate components and complex interconnections.

Innovation Solution

The integration of a liquid driving unit and a cooling plate module within a casing, with reduced ducting, allowing for compact space utilization while maintaining liquid storage, circulation, and heat convection functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate components (heat dissipation stage, water pump, cooling stage, water tank) are used with interconnecting ducts, then heat dissipation function is achieved, but the system becomes bulky and difficult to assemble

Engineering Contradiction:
Improveheat dissipation functionVSAvoidsystem structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation stage, cooling stage, and water tank into an integrated cooling plate assembly. The heat dissipation plate and cooling plate are positioned facing each other with a sealed cavity between them that contains the cooling liquid, eliminating the need for separate water tanks and complex interconnecting ducts while maintaining the heat dissipation function through the integrated structure

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If separate components with interconnecting ducts are used, then heat dissipation function is achieved, but the system occupies excessive space

Engineering Contradiction:
Improveheat dissipation functionVSAvoidsystem volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The cooling liquid channel is nested within the sealed cavity formed between the heat dissipation plate and cooling plate. The liquid driving unit is integrated into the cooling plate structure, with its outlet positioned to directly communicate with the cooling liquid channel inlet. This nested arrangement allows the cooling function to be embedded within the heat dissipation structure itself, minimizing overall system volume

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If separate components are used, then heat dissipation function is achieved, but assembly becomes difficult

Engineering Contradiction:
Improveheat dissipation functionVSAvoidassembly ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The heat dissipation plate, cooling plate, and liquid driving unit are combined into a single integrated assembly that can be installed as one unit. The sealing structure is integrated into this assembly, providing a complete pre-assembled module that simplifies installation while maintaining the heat dissipation function through the integrated design

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient heat dissipation for CPUs in a compact form factor, enhancing performance and assembly ease by integrating key components and optimizing fluid dynamics within the casing.

Implementation Method 1

the water pump 20a conveys cool water to the heat dissipation stage 10a for heat exchanging into hot water. Afterward, hot water flows to the cooling stage 30a through the duct 104a for heat exchanging into cool water there

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

When the hot water in the liquid inlet flows into the liquid outlet through the runner, the hot water is heat exchanged with the heat-dissipating fins into cool water

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS7325591B2Liquid-cooling heat dissipation apparatus
Publication Date: 2008.02.05 CHEMTRON RESEARCH LLC
  • US7325591B2 patent drawing
  • US7325591B2 patent drawing
  • US7325591B2 patent drawing

AI summary

A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid therein. At least one liquid inlet and liquid outlet are defined on the casing and communicated through the second compartment. Therefore, the liquid driving unit and the cooling plate module can be advantageously integrated into the casing while the duct is reduced to achieve compact space. Moreover, the overall structure achieves liquid storing, circulating and heat conveying function.