Integrated Load Lock Chamber for In-Situ Thermal Processing
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Solution Overview
Problem
Existing semiconductor processing systems face inefficiencies in transferring workpieces between different pressure environments and lack integrated thermal processing capabilities within the load lock chamber.
Innovation Solution
A load lock chamber equipped with a workpiece handling robot and thermal processing assembly that allows for direct transfer of workpieces to and from processing chambers while enabling thermal processing within the load lock chamber, eliminating the need for additional transfer chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If workpieces are transferred between different pressure environments using conventional systems, then workpiece transfer is achieved, but additional transfer chambers are required increasing system complexity
Solution Approach 1:
The patent combines the load lock chamber and thermal processing chamber into a single integrated chamber. The load lock functionality (pressure transition) and thermal processing functionality are merged, eliminating the need for separate transfer chambers. The chamber can operate in different pressure modes and can perform both loading and thermal processing functions, thereby reducing system complexity while maintaining or improving productivity.
Solution Approach 2:
The integrated chamber serves multiple functions: it acts as a load lock for pressure transitions, a thermal processing chamber for heating workpieces, and a transfer station. The chamber can selectively operate in different modes (load lock mode, thermal processing mode) and can handle multiple workpieces simultaneously on different shelves, providing multi-functionality that reduces the need for additional specialized chambers.
2Loss of time
If workpieces are transferred through multiple chambers, then pressure environment transitions are achieved, but processing time increases
Solution Approach 1:
By merging the load lock and thermal processing functions into one chamber, the patent eliminates the time required for workpieces to travel between separate chambers. The workpiece can be loaded and thermally processed in the same chamber without intermediate transfers, significantly reducing processing time while the chamber maintains reliable pressure control through its dual-mode operation capability.
3Productivity
If thermal processing is performed in separate chambers, then thermal processing is achieved, but additional transfer steps are required
Solution Approach 1:
The patent merges thermal processing functionality into the load lock chamber, eliminating the need for separate thermal processing chambers. Workpieces can be thermally processed directly in the load lock chamber after loading, removing intermediate transfer steps and improving processing efficiency without requiring additional chamber configurations.
Solution Approach 2:
The load lock chamber is designed to perform multiple functions including pressure transition, thermal processing, and workpiece storage. The chamber can selectively operate as a load lock, a thermal processing chamber, or both simultaneously with multiple workpieces on different shelves, providing the multi-functionality needed to improve productivity without increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates faster and more efficient thermal processing of workpieces by integrating thermal processing directly within the load lock chamber, enhancing processing efficiency and reducing the need for additional transfer steps.
Implementation Method 1
a thermal processing assembly positioned within the load lock chamber and configured to thermally process a workpiece when the workpiece is positioned within the thermal processing region
Implementation Method 2
thermally processing the workpiece within the thermal processing region while the workpiece is on an end effector of the workpiece handling robot
Data Source
AI summary
A load lock chamber of a workpiece processing apparatus is provided. The load lock chamber includes a workpiece handling robot comprising a first arm configured to transfer a workpiece along a first plane to and from a thermal processing region defined within the load lock chamber. The load lock chamber further includes a thermal processing assembly configured to thermally process the workpiece when the workpiece is positioned within the thermal processing region defined within the load lock chamber. The workpiece handling robot is further configured to transfer the workpiece along the first plane to a processing chamber of the workpiece processing apparatus.