Loudspeaker Assembly with Integrated Dust-Cover Support for Reduced Thickness
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Solution Overview
Problem
The thickness of electronic device terminals is increased due to the design of the upper speaker, which conflicts with the lightweight design requirements.
Innovation Solution
A speaker assembly design that includes a housing with a first sound outlet and accommodating grooves for the support and speaker, utilizing double-sided tapes for fixation and a dust cover to minimize thickness, along with a dust collecting slot to prevent dust entry and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the upper speaker is fixed to the housing through a support double-sided tape and sealed with a support dust cover assembly, then the speaker assembly is securely mounted and sealed, but the lamination thickness between the housing and the upper speaker exceeds 1.0 mm, resulting in a relatively large thickness of the whole machine
Solution Approach 1:
The patent combines the dust cover and support into a single integrated component. The dust cover includes a dust cover body and a dust cover support that forms an integrated assembly with the support, eliminating the need for separate support and dust cover components. This merging reduces the overall lamination thickness while maintaining the sealing and mounting functions.
Solution Approach 2:
The patent employs a nested structure where the speaker is mounted on the support, which is then integrated with the dust cover. The supporting member is disposed in the accommodating groove of the support, and the dust cover support integrates with the support structure. This nesting arrangement allows multiple functions to be combined within a compact thickness, reducing the overall device thickness.
2Length of stationary object
If the lamination thickness between the housing and the upper speaker is reduced to minimize device thickness, then the terminal achieves a thinner profile, but the structural integrity and sealing may be compromised
Solution Approach 1:
The patent uses composite material structures in the integrated dust cover and support assembly. The dust cover body and dust cover support are formed as an integrated composite structure that provides both sealing and structural support functions. This composite design maintains structural integrity while achieving reduced thickness.
Solution Approach 2:
The patent employs thin film structures in the dust cover and support assembly. The integrated dust cover and support use thin film materials that provide adequate sealing and structural support with minimal thickness. The supporting member and dust cover support are designed as thin structural elements that maintain integrity while reducing overall device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the overall thickness of the electronic device by minimizing the lamination thickness and preventing dust entry, thereby enhancing audio quality and user experience.
Implementation Method 1
a support 2 mounted to the housing 1
Implementation Method 2
a speaker 3 mounted to the support 2... the speaker 3 has a second sound outlet
Data Source
Figure 1~2
Figure 3~4
AI summary
The present application discloses a speaker assembly and an electronic device. The speaker assembly includes: a housing, where a first sound outlet and a first accommodating groove are provided on the housing, and the first sound outlet is in communication with the first accommodating groove through a sound output channel; a support mounted to the housing, where at least a portion of the support is disposed in the first accommodating groove, a second accommodating groove is disposed at a side of the support away from the first sound outlet, a first opening is disposed at a side of the support close to the first sound outlet, and the second accommodating groove is in communication with the sound output channel through the first opening; and a speaker mounted to the support, where at least a portion of the speaker is disposed in the second accommodating groove, the speaker has a second sound outlet, and the second sound outlet is in communication with the first opening.