Integrated MAC Chip with Silicon Hybrid Optical Transceiver
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Solution Overview
Problem
Existing optical communication systems have large terminal devices with high power consumption and high costs due to the inclusion of separate optical transceiver modules, MAC chips, and peripheral circuits.
Innovation Solution
A novel Media Access Control (MAC) chip is developed with a self-contained optical transceiver function, integrating a silicon substrate layer, silicon dioxide base layer, silicon base layer, and an element layer featuring a laser, passive device, detector, and drive circuit, formed using a silicon base hybrid integration mode, eliminating the need for a separate optical transceiver module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate optical transceiver module, MAC chip and peripheral circuit are used, then functional reliability is improved, but device size increases and power consumption increases
Solution Approach 1:
The patent combines the optical transceiver module, MAC chip, and peripheral circuits into a single integrated optical transceiver chip. The chip includes optical emission unit, optical reception unit, MAC processing unit, and peripheral circuit units all fabricated on the same semiconductor substrate, eliminating the need for separate components and reducing overall device size while maintaining functional reliability through integrated design.
Solution Approach 2:
The integrated optical transceiver chip performs multiple functions within a single device: optical signal transmission, optical signal reception, MAC layer processing, and peripheral circuit operations. This multi-functional integration reduces the number of separate components needed in the terminal device while ensuring all necessary functions are available.
2Reliability
If separate optical transceiver module, MAC chip and peripheral circuit are used, then functional reliability is improved, but power consumption increases
Solution Approach 1:
The patent combines the optical transceiver module, MAC chip, and peripheral circuits into a single integrated optical transceiver chip. The chip includes optical emission unit, optical reception unit, MAC processing unit, and peripheral circuit units all fabricated on the same semiconductor substrate, eliminating the need for separate components and reducing overall device size while maintaining functional reliability through integrated design.
Solution Approach 2:
The integrated optical transceiver chip performs multiple functions within a single device: optical signal transmission, optical signal reception, MAC layer processing, and peripheral circuit operations. This multi-functional integration reduces the number of separate components needed in the terminal device while ensuring all necessary functions are available.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the size and power consumption of the terminal device, while also lowering production costs by incorporating a CMOS process and III-V laser bonding for enhanced stability and functionality.
Implementation Method 1
a laser (41), a passive device (42), a detector (43)
Implementation Method 2
a laser (41), a passive device (42), a detector (43)
Data Source
Figure 1~2
AI summary
The present application discloses a Media Access Control (MAC) chip and a terminal device. The MAC chip includes a silicon substrate layer (1), a silicon dioxide base layer (2) formed on a surface of the silicon substrate layer (1), and a silicon base layer (3) formed on a surface, away from the silicon substrate layer, of the silicon dioxide base layer (1); and an element layer (4) formed on a surface, away from the silicon dioxide base layer (2), of the silicon base layer (3), and herein the element layer (4) includes a laser (41), a passive device (42), a detector (43), a drive circuit (44) and an MAC chip body (45), herein the drive circuit (44) is respectively connected with the laser (41), the detector (43) and the MAC chip body (45), and the laser (41) is connected with the detector (43) through the passive device (42).