Integrated Permanent Magnet Substrates for Precise Field Alignment
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Solution Overview
Problem
Existing methods for manufacturing electronic devices with permanent magnets struggle with precision and flexibility in integrating magnets directly on the substrate level, leading to potential adjustment errors and limitations in magnetic field customization.
Innovation Solution
A method involving the structuring of cavities in a substrate, filling them with magnetic powder, and agglomerating it using atomic layer deposition to form a mechanically firm permanent magnet, which is then integrated with electronic components on a second substrate, allowing for precise alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If permanent magnets are mounted in a hybrid way together with the electronic device to form an assembly, then the magnetic field can be provided for the electronic component, but adjustment errors occur in pick-and-place mounting and the assembly cannot be miniaturized
Solution Approach 1:
The patent merges the permanent magnet and electronic component into a single integrated assembly where the magnet is formed directly on the substrate containing the electronic component. This eliminates the need for separate pick-and-place mounting operations and reduces assembly complexity while improving positioning precision.
Solution Approach 2:
The permanent magnet is formed preliminarily on the substrate before final assembly completion. By using a mask layer and deposition process, the magnet position is predetermined during manufacturing, eliminating subsequent adjustment errors and simplifying the overall assembly process.
2Adaptability or versatility
If conventional permanent magnets are used, then the magnetic field can be generated, but the shapes cannot be freely selected to locally adjust the magnetic field precisely
Solution Approach 1:
The patent applies local quality by allowing different regions of the permanent magnet to have different magnetic properties through selective deposition. The mask layer enables local adjustment of magnetic field strength and direction, providing both flexibility and precision in magnetic field configuration.
Solution Approach 2:
The magnetic field characteristics can be adjusted by changing deposition parameters such as thickness, material composition, and deposition area. This provides flexible control over magnetic field strength and distribution while maintaining high manufacturing precision through controlled deposition processes.
3Strength
If loose powder comprising magnetic material is introduced into the cavity and agglomerated by atomic layer deposition, then a mechanically firm magnetic body structure is generated, but the process complexity increases
Solution Approach 1:
The patent replaces mechanical compression or bonding methods with atomic layer deposition to create the mechanically firm magnetic structure. This chemical vapor deposition process provides superior mechanical strength and integration while being compatible with standard semiconductor manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the precise integration of permanent magnets with electronic devices on the substrate level, allowing for customizable magnetic fields with high spatial precision, reducing adjustment errors, and enabling miniaturization of magnetic assemblies.
Implementation Method 1
generating the integrated permanent magnet within the cavity by introducing loose powder comprising magnetic material into the cavity and by subsequently agglomerating the powder to a mechanically firm magnetic body structure by means of atomic layer deposition
Implementation Method 2
the permanent magnet integrated into the first substrate functionally interacts with the electronic component arranged on the second substrate and provides a magnetic field for the electronic component
Data Source
AI summary
A method for manufacturing an electronic device with an integrated permanent magnet for providing a magnetic field is disclosed. The method includes providing a first substrate and structuring a cavity into a first substrate surface. The permanent magnet integrated within the cavity is generated by introducing loose powder including magnetic material into the cavity and by subsequently agglomerating the powder to a mechanically firm magnetic body structure by means of atomic layer deposition. The method further includes providing a second substrate, wherein at least one electronic component is arranged on a first substrate surface of the second substrate, and aligning the two substrates with respect to each other so that the permanent magnet integrated into the first substrate functionally interacts with the electronic component arranged on the second substrate and provides a magnetic field for the electronic component. The two substrates are bonded by means of a bonding layer attached between the two substrates.