Integrated Magnetic Assembly for Compact High-Isolation Transformers
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Solution Overview
Problem
Laminated isolation transformers face challenges such as high cost, large form factor, coarse design parameters, and delamination risks in production and use, which hinder their effectiveness in power conversion and communication applications.
Innovation Solution
A multilevel package substrate with patterned conductive features and molded dielectric features is used to create primary and secondary coil windings, integrated with magnetic shields to form a compact and robust electronic device that provides high voltage isolation, reducing size and manufacturing risks while enhancing structural integrity and electromagnetic interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laminated structures are used for isolation transformers, then manufacturing is simplified, but the form factor (body size and thickness) becomes large
Solution Approach 1:
The patent transitions from planar laminated windings to three-dimensional coil structures formed by folding and stacking conductive layers. This dimensional change allows the magnetic assembly to achieve compact form factor while maintaining manufacturing simplicity through sequential lamination processes.
Solution Approach 2:
The patent implements nested winding structures where inner and outer coils are positioned concentrically within the magnetic core. This nesting approach maximizes space utilization, reducing the overall form factor while maintaining the required number of turns and electrical isolation.
2Ease of manufacture
If laminated structures are used for isolation transformers, then manufacturing is simplified, but cost increases
Solution Approach 1:
The patent divides the magnetic assembly into modular laminated layers that can be manufactured separately and then assembled. This segmentation enables standardized production processes, reducing tooling costs and facilitating volume manufacturing while maintaining structural integrity.
Solution Approach 2:
The patent optimizes lamination parameters such as layer thickness, material composition, and stacking sequences to balance manufacturing complexity with performance requirements. By carefully controlling these parameters, the design achieves cost-effectiveness through reduced material usage and simplified assembly processes.
3Ease of manufacture
If laminated structures are used for isolation transformers, then manufacturing is simplified, but delamination risk increases in production or use
Solution Approach 1:
The patent employs composite lamination structures with optimized material combinations, including magnetic cores with specific permeability and loss characteristics, and insulating layers with appropriate dielectric strength. These composite materials provide inherent delamination resistance while maintaining manufacturing simplicity through established lamination techniques.
Solution Approach 2:
The patent incorporates preventive design features such as interlayer adhesives, optimized bonding surfaces, and stress-distributing structural elements that prevent delamination before it occurs. These preemptive measures address potential failure modes during manufacturing and operation without complicating the overall lamination process.
4Ease of manufacture
If laminated structures are used for isolation transformers, then manufacturing is simplified, but design rule parameters become coarse
Solution Approach 1:
The patent utilizes three-dimensional coil geometries formed through controlled folding and stacking of conductive layers, enabling precise control of winding parameters such as turn density, distribution, and spatial arrangement. This approach achieves fine design rule parameters while maintaining manufacturing simplicity through sequential lamination and forming operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the development of small form factor electronic devices with improved structural integrity and reduced size, offering high voltage isolation and efficient electromagnetic interference protection, suitable for automotive and industrial applications.
Implementation Method 1
Isolation transformers have coils to isolate two or more circuits from one another in power conversion, communications, and other applications
Implementation Method 2
integrated with magnetic shields to form a compact and robust electronic device that provides high voltage isolation, reducing size and manufacturing risks while enhancing structural integrity and electromagnetic interference protection
Data Source
AI summary
An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate.