Integrated Magnetic Assembly for High-Voltage Power Density
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Solution Overview
Problem
Conventional power converters face limitations in integrating magnetic components into integrated circuits for high-voltage applications due to mold compound and design parameters, leading to increased electronic system size and reduced power density.
Innovation Solution
A leadframeless structure integrating a packaged electronic device and a coil within a magnetic structure, with exposed terminals for direct soldering to a circuit board, allowing for high-voltage operation and reduced material and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If magnetic components are integrated into packaged electronic devices, then power density increases and circuit board space is conserved, but manufacturing complexity and design difficulty increase due to mold compound limitations
Solution Approach 1:
The patent merges the packaged electronic device, coil, and magnetic structure into a single integrated assembly. The magnetic structure is formed as an integral part of the package, enclosing the coil and electronic device components within its magnetic circuit path, eliminating the need for separate magnetic components and reducing overall assembly complexity despite the integrated nature.
Solution Approach 2:
The magnetic structure serves multiple functions simultaneously: it provides the magnetic circuit path for the coil, encloses and protects the electronic device components, and establishes the physical package structure. This multi-functionality reduces the number of separate components needed and simplifies the overall manufacturing process.
2Ease of manufacture
If conventional separate components are used, then manufacturing is simpler, but electronic system size increases and power density decreases
Solution Approach 1:
The patent implements a nested structure where the coil is positioned within the magnetic structure, and the packaged electronic device is integrated within the same assembly. The magnetic structure encloses portions of both the coil and electronic device, creating a compact nested arrangement that reduces overall system volume while maintaining manufacturability through standardized packaging processes.
Solution Approach 2:
The patent transitions from a planar arrangement of separate components on a circuit board to a three-dimensional integrated structure. The magnetic structure extends in multiple dimensions, enclosing components vertically and laterally, thereby reducing the footprint on the circuit board while maintaining ease of manufacture through vertical integration rather than horizontal expansion.
3Quantity of substance
If magnetic components are integrated for high-voltage applications, then power density increases, but design parameters and mold compound requirements become more stringent
Solution Approach 1:
The patent modifies key design parameters including the magnetic structure's permeability, the coil's winding configuration, and the package's dimensional tolerances to optimize performance for high-voltage applications. By carefully controlling these parameters within the mold compound manufacturing process, the design achieves high power density while maintaining manufacturability through standardized processes.
Solution Approach 2:
The patent employs composite material structures combining magnetic materials with mold compound materials that have specific electrical and magnetic properties. This composite approach allows the magnetic structure to provide both the magnetic circuit path and the necessary electrical insulation for high-voltage operation, reducing the need for separate insulation components and simplifying manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables compact, cost-effective integration of magnetic components in power converters, facilitating high-voltage operation and enhancing power density by conserving circuit board space and reducing manufacturing costs.
Implementation Method 1
a magnetic structure that encloses portions of the packaged electronic device and the coil
Implementation Method 2
a coil having a second terminal that is spaced apart from the first terminal
Data Source
AI summary
An apparatus includes a packaged electronic device having a first terminal, a coil having a second terminal that is spaced apart from the first terminal, and a magnetic structure that encloses portions of the packaged electronic device and the coil and exposes respective portions of the first and second terminals. A method of manufacturing an electronic apparatus includes attaching a first terminal of a packaged electronic device to a carrier, attaching a second terminal of a coil to the carrier, performing a molding process using a magnetic molding compound to form a molded magnetic structure that encloses portions of the packaged electronic device and the coil, and removing the carrier to expose portions of the first and second terminals.