Integrated Magnetics Module Layout for High-Frequency Current Sharing
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Solution Overview
Problem
The challenge lies in efficiently connecting discrete magnetic and power semiconductor components at high frequencies, where existing methods face difficulties in optimizing current distribution and minimizing proximity effects, loop inductance, and size constraints, especially when transitioning from embedded to discrete assembly structures.
Innovation Solution
The solution involves creating interleaving layers for countervailing current flow and parallel paths at the interface of discrete assemblies, using separate magnetic element pieces that are not constrained by mold-making techniques, and configuring substrates to maximize current sharing across layers, along with concentric cylinder pin terminals for optimal current distribution and reduced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete magnetic and power semiconductor components are connected using existing methods, then the assembly structure is simpler to manufacture, but high-frequency current distribution is suboptimal with increased proximity effects and loop inductance
Solution Approach 1:
The patent merges discrete magnetic components and power semiconductor components into a single integrated module assembly. The magnetic component and power semiconductor component are positioned in close proximity with optimized spatial arrangement, creating an integrated structure that minimizes loop inductance and improves high-frequency current distribution while maintaining manufacturability
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement of components within the module assembly. By optimizing the vertical and horizontal positioning of magnetic and power semiconductor components, the design creates optimized current paths through multiple dimensions, reducing proximity effects and loop inductance without increasing planar footprint
2Reliability
If components are integrated into one composite structure, then current distribution is optimized, but manufacturing complexity increases
Solution Approach 1:
The integrated module is designed as an assembly of discrete but closely coupled components rather than a monolithic structure. The magnetic component, power semiconductor component, and substrate remain separate manufacturable units that are subsequently assembled, allowing each component to be manufactured using standard processes while achieving optimized current distribution in the final assembly
Solution Approach 2:
The substrate serves as an intermediary element that facilitates the integration of magnetic and power semiconductor components. The substrate provides mechanical support and electrical interconnections, enabling optimized current paths between components while maintaining ease of manufacturing through standardized PCB techniques
3Ease of manufacture
If mold-making techniques are used for magnetic components, then manufacturing is easier, but design flexibility and scalability are constrained
Solution Approach 1:
The magnetic component is designed as a separable element that can be manufactured using conventional mold-making techniques for the magnetic core, while the winding structure and terminal configurations can be varied independently. This segmentation allows standard manufacturing for the magnetic core while maintaining design flexibility for the winding arrangements and terminal positions
4Volume of moving object
If component size is reduced, then power conversion module density increases, but optimizing current distribution and minimizing proximity effects becomes more difficult
Solution Approach 1:
The patent employs three-dimensional packaging and spatial arrangement of components within the compact module. By utilizing vertical stacking and optimized layer positioning, the design achieves reduced overall module volume while maintaining adequate current distribution paths and minimizing proximity effects through careful positioning of magnetic and power semiconductor components in the third dimension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances high-frequency current distribution, reduces ac proximity loss and copper loss, and allows for scalable and flexible design, overcoming size limitations and improving the overall efficiency of power conversion modules.
Implementation Method 1
The magnetic elements contain the flux generated by the flow of currents in windings within the substrates 101 and 102
Implementation Method 2
The magnetic elements contain the flux generated by the flow of currents in windings within the substrates 101 and 102
Implementation Method 3
The multi-pole magnetic elements are typically of a ferromagnetic material due to the high frequencies employed
Data Source
AI summary
The present invention discloses several means for combining together electrically and physically a single or multi-pole discrete magnetic device structure into an external main power-processing assembly or structure, which contains power semiconductor components and other power components. The point of interface and electrical connection mainly consists of winding terminations, power semiconductors and capacitors and creating the most optimum path for high frequency current flow and distribution in that region. This invention discloses several optimum methods for combining the two structures not previously done in prior art. In addition, the disclosure resolves how to optimize the high frequency current distribution at the point of connection or interface of the two discrete assemblies. It does so by creating interleaving layers of countervailing current flow and parallel paths of current flow on each layer at the interface or connection point of the two discrete assemblies.