Integrated Memory IC Chip Carrier Segmentation

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Solution Overview

Problem

The existing method of attaching memory to semiconductor chips before attaching them to a chip carrier is unreliable, leading to potential damage and discard of otherwise reliable chips.

Innovation Solution

A method of integrating memory into the IC chip carrier using a dielectric material to join the memory, heat spreader, and IC chip carrier, with vertical interconnect access (VIA) formed within the heat spreader and dielectric material to connect the memory and IC chip surfaces coplanarly, allowing for reliable attachment without subjecting the IC chip to multiple unreliable processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If memory is attached to the semiconductor chip before attaching to chip carrier, then memory proximity to IC chip is achieved, but reliability of the IC chip is compromised due to multiple unreliable attachment processes

Engineering Contradiction:

ImprovereliabilityVSAvoidattachment processes

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the attachment process into two separate stages: first attaching memory to the chip carrier, then attaching the IC chip to the same carrier. This segmentation isolates the IC chip from the potentially damaging memory attachment processes, protecting chip reliability while still achieving the goal of memory proximity to the IC chip through the shared carrier platform.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chip carrier serves as an intermediary platform that hosts both the memory and the IC chip. By using the carrier as a mediator, the patent enables memory and IC chip to be in close proximity without requiring direct attachment between them, thus avoiding the reliability issues of direct memory-to-chip attachment while maintaining the benefits of short wiring.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Length of moving object

If memory is attached to the semiconductor chip, then wiring length between memory and IC chip is reduced, but the IC chip may be damaged and discarded

Engineering Contradiction:

Improvewiring lengthVSAvoidIC chip integrity

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent separates the memory attachment process from the IC chip attachment process by using the chip carrier as an intermediate platform. This allows the memory to be attached to the carrier without directly subjecting the IC chip to the attachment processes, thereby maintaining short wiring lengths while preserving IC chip integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chip carrier acts as an intermediary that hosts both the memory and IC chip, enabling short wiring connections between them without requiring direct memory-to-chip attachment. This intermediary approach eliminates the risk of IC chip damage during memory attachment while maintaining the benefit of reduced wiring length.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If multiple attachment processes are used to attach memory to IC chip, then memory integration is achieved, but manufacturing yield decreases

Engineering Contradiction:

Improvememory integrationVSAvoidmanufacturing yield

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent segments the manufacturing process into independent stages: memory attachment to carrier, then IC chip attachment to carrier. This segmentation allows each stage to be optimized separately and reduces the cumulative failure risk of multiple sequential attachment processes, thereby improving manufacturing yield while maintaining ease of memory integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The memory is attached to the chip carrier in advance, before the IC chip attachment process. This preliminary action allows the memory to be positioned and secured on the carrier without exposing the IC chip to potential damage, simplifying the overall manufacturing process and improving yield by eliminating rework or discard of damaged chips.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures the reliability of the IC chip carrier and memory package by integrating memory into the carrier before attaching the IC chip, reducing the risk of damage and increasing yield, while maintaining the IC chip's integrity.

Implementation Method 1

joining a memory, a heat spreader, and a IC chip carrier with a dielectric material

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

the heat spreader contacts a sidewall of the memory

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10892249B2Carrier and integrated memory

Publication Date: 2021.01.12 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.