Integrated Memory Coprocessor Bypassing Cache Latency

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current network processing units (NPUs) face latency issues due to the need for data transfer between on-die caches and off-chip memory, which complicates packet processing and increases power consumption, especially when handling high-bandwidth network traffic.

Innovation Solution

An integrated main memory and coprocessor chip (MMCC) design that eliminates the need for caching data from off-chip resources, allowing for direct on-chip processing and storage, reducing latency and power consumption by bypassing external memory access and cache coherence overhead.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If data is stored in off-chip memory and accessed through cache, then memory capacity is sufficient, but latency is increased due to multiple access steps

Engineering Contradiction:
Improvememory access latencyVSAvoidmemory access structure
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The patent merges the main memory and coprocessor onto a single chip, eliminating the need for separate off-chip memory and cache structures. This integration allows direct access between the coprocessor and memory without requiring multiple access steps through cache, thereby reducing latency while maintaining sufficient memory capacity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the cache layer from the memory access path by providing direct coprocessor access to main memory. This removes the intermediate caching step that contributes to latency, allowing the coprocessor to access memory directly without the complexity of cache management.

Inventive Principle:
Principle #2Taking out (Extraction)

2Use of energy by moving object

If multiple processors share external memory, then data sharing is enabled, but power consumption increases due to repeated external access

Engineering Contradiction:
Improvepower consumptionVSAvoiddata processing throughput
Core Design Contradiction:
Use of energy by moving objectVSProductivity

Solution Approach 1:

By integrating multiple coprocessors and memory on the same chip, the patent enables them to share the integrated memory structure without requiring repeated external memory access. This sharing mechanism reduces power consumption while maintaining high data processing throughput through on-chip communication pathways.

Inventive Principle:
Principle #5Merging (Combining)

3Speed

If cache is used to store frequently accessed data, then access speed improves, but cache coherence overhead increases

Engineering Contradiction:
Improvedata access speedVSAvoidcache coherence management
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent removes the cache coherence management overhead by eliminating the cache layer entirely. Instead of managing cache coherence between multiple processors, the system provides direct access to the integrated memory structure, achieving fast data access without the complexity of cache coherence protocols.

Inventive Principle:
Principle #2Taking out (Extraction)

4Loss of time

If data is transferred between chip interfaces for processing, then processing capability is sufficient, but latency is incurred due to framing and transmission

Engineering Contradiction:
Improvedata transfer latencyVSAvoidpacket processing rate
Core Design Contradiction:
Loss of timeVSProductivity

Solution Approach 1:

The patent merges the coprocessor and memory onto the same chip, eliminating the need for data transfer between separate chip interfaces. This integration removes the framing and transmission steps that contribute to latency, enabling high packet processing rates through direct on-chip data access and processing.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10114558B2Integrated main memory and coprocessor with low latency
Publication Date: 2018.10.30 MOSYS INC
  • US10114558B2 patent drawing
  • US10114558B2 patent drawing
  • US10114558B2 patent drawing

AI summary

System, method, and apparatus for integrated main memory (MM) and configurable coprocessor (CP) chip for processing subset of network functions. Chip supports external accesses to MM without additional latency from on-chip CP. On-chip memory scheduler resolves all bank conflicts and configurably load balances MM accesses. Instruction set and data on which the CP executes instructions are all disposed on-chip with no on-chip cache memory, thereby avoiding latency and coherency issues. Multiple independent and orthogonal threading domains used: a FIFO-based scheduling domain (SD) for the I/O; a multi-threaded processing domain for the CP. The CP is an array of independent, autonomous, unsequenced processing engines processing on-chip data tracked by SD of external CMD and reordered per FIFO CMD sequence before transmission. Paired I/O ports tied to unique global on-chip SD allow multiple external processors to slave chip and its resources independently and autonomously without scheduling between the external processors.