Integrated MEMS Force and Acceleration Sensor
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Solution Overview
Problem
Existing MEMS devices for pressure and acceleration sensing lack integration and efficient measurement capabilities, requiring separate devices for each function.
Innovation Solution
A sensor device integrating a microelectromechanical system (MEMS) force sensor and a capacitive acceleration sensor, where the MEMS sensor includes a frame, membrane, piezo-resistive elements, and a cavity, and the capacitive sensor includes a capacitor with electrodes, allowing for simultaneous measurement of pressure and acceleration using a single device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate devices are used for pressure sensing and acceleration sensing, then each sensor can be optimized for its specific function, but the overall system complexity increases and simultaneous measurement efficiency decreases
Solution Approach 1:
The patent combines a MEMS force sensor and a capacitive acceleration sensor into a single integrated device. The MEMS force sensor measures pressure through a diaphragm and piezoresistive elements, while the capacitive acceleration sensor measures acceleration through movable and fixed electrodes. Both sensors share common structural elements and are fabricated using compatible semiconductor processes, enabling simultaneous measurement of pressure and acceleration with high precision while reducing overall system complexity
Solution Approach 2:
The integrated sensor device performs multiple functions simultaneously: it measures both pressure (via the MEMS force sensor) and acceleration (via the capacitive acceleration sensor). The shared substrate and compatible fabrication processes allow the device to serve as a multi-functional sensing platform, eliminating the need for separate pressure and acceleration sensors
2Reliability
If separate devices are used for pressure sensing and acceleration sensing, then each sensor can be independently optimized, but manufacturing efficiency and integration functionality deteriorate
Solution Approach 1:
The patent integrates both pressure and acceleration sensing functions into a single device fabricated using compatible semiconductor processes. The MEMS force sensor and capacitive acceleration sensor are manufactured simultaneously on the same substrate using standard CMOS or MEMS fabrication techniques, improving manufacturing efficiency while maintaining the reliability of both sensing functions through independent optimization of each sensor type
Solution Approach 2:
The device is segmented into distinct functional regions: the MEMS force sensor region with its diaphragm and piezoresistive elements, and the capacitive acceleration sensor region with its movable and fixed electrodes. This segmentation allows each sensor type to be independently optimized for its specific function while being manufactured as an integrated device, maintaining high reliability for both pressure and acceleration measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and integrated measurement of pressure and acceleration using a single device, enhancing efficiency and reducing the need for multiple sensors.
Implementation Method 1
piezo-resistive elements
Implementation Method 2
capacitive acceleration sensor includes a capacitor having a first electrode and a second electrode facing the first electrode
Data Source
AI summary
A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.