Integrated MEMS and Magnetic Sensor Device for Compact Navigation
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Solution Overview
Problem
Mobile navigation devices require separate MEMS accelerometers and magnetic sensors, which occupy a large printed circuit board (PCB) footprint, making them costly and size-sensitive.
Innovation Solution
An integrated sensor device is created by stacking a MEMS sensor with a magnetic sensor, utilizing the electrically unused areas of the substrates to host additional sensors, reducing semiconductor material usage and PCB footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate MEMS accelerometer and magnetic sensor devices are used, then navigation and orientation functionality is achieved, but PCB footprint and device size increase
Solution Approach 1:
The patent combines a MEMS accelerometer and a magnetic sensor into a single integrated sensor device, where both sensors share a common substrate and packaging structure. This merging reduces the number of separate components from two to one, directly decreasing the PCB footprint while maintaining both acceleration sensing and magnetic field sensing capabilities for navigation and orientation functions
Solution Approach 2:
The integrated sensor device performs multiple functions within a single component: it simultaneously provides acceleration measurement (MEMS function) and magnetic field measurement (compass function). This multi-functionality eliminates the need for separate dedicated components, reducing overall device size and PCB space requirements while maintaining full navigation and orientation functionality
2Reliability
If separate MEMS accelerometer and magnetic sensor devices are used, then sensor functionality is achieved, but fabrication cost increases
Solution Approach 1:
By integrating both MEMS and magnetic sensors into a single device with shared substrate and packaging, the patent reduces the total number of fabrication processes, assembly steps, and component purchases required. This consolidation lowers per-unit costs through economies of scale and reduced manufacturing complexity
Solution Approach 2:
The patent transitions from a planar arrangement of separate sensors to a three-dimensional integrated structure where sensors are stacked or positioned in different spatial layers within a single package. This vertical integration reduces material usage and simplifies interconnections, thereby reducing fabrication costs
Data Source
AI summary
An integrated sensor device is provided. The integrated sensor device comprises a first substrate including a surface portion and a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors.