Integrated MEMS Microsystem With Insulating Base and Cap Layers
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Solution Overview
Problem
Integration of multiple MEMS devices, such as TIMUs, into a single structure is hindered by issues like large size, device coupling, conflicting process and package requirements, and challenges in temperature control, vibration/shock isolation, and sensor fusion.
Innovation Solution
A microsystem design featuring a MEMS device layer sandwiched between a package base layer and a cap layer, both made from electrical insulating materials, with feedthroughs for electrical communication and operative materials for functionalization, allowing for the integration of multiple devices like gyroscopes, accelerometers, and resonators on a single substrate with thermal and mechanical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple MEMS devices are integrated into a single structure, then device functionality and sensor fusion are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent integrates multiple MEMS devices (accelerometers, gyroscopes, resonators) into a single unified structure fabricated on one substrate. This merging approach combines previously discrete sensor units into one compact system, achieving sensor fusion and improved adaptability while managing complexity through unified fabrication processes
Solution Approach 2:
The integrated MEMS structure serves multiple functions simultaneously - it contains accelerometers for acceleration sensing, gyroscopes for rotational sensing, and resonators for timing functions. This multi-functional design allows a single device to replace multiple separate components, enhancing versatility without proportionally increasing complexity
2Volume of moving object
If multiple MEMS devices are integrated into a single structure, then space efficiency is improved, but device coupling and environmental sensitivity increase
Solution Approach 1:
The integrated structure is divided into separate functional regions or zones, with each MEMS device (accelerometer, gyroscope, resonator) having its own designated area on the substrate. This segmentation allows each sensor to operate independently while maintaining compact integration, reducing unwanted coupling between devices and minimizing environmental sensitivity
Solution Approach 2:
The patent introduces isolation structures or intermediary elements between adjacent MEMS devices to prevent coupling. These intermediaries act as barriers that reduce cross-talk and environmental interference between sensors, allowing compact integration while maintaining individual device performance and reducing environmental sensitivity
3Manufacturing precision
If silicon structures are used for MEMS devices, then manufacturing precision is improved, but electrical insulation requirements increase process complexity
Solution Approach 1:
The patent extracts or removes the conductivity issue from silicon structures by implementing insulation layers or isolation techniques that eliminate the need for additional insulating steps. This extraction approach maintains the manufacturing precision benefits of silicon while removing the process complexity associated with electrical insulation requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables compact, efficient integration of multiple MEMS devices with improved thermal and mechanical isolation, reducing environmental sensitivity and enhancing bias stability and sensitivity of the integrated sensors.
Implementation Method 1
bonded with low thermal coefficient of expansion glass frit
Implementation Method 2
feedthroughs allow electrical communication
Data Source
AI summary
A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.