Integrated MEMS Microphone and Environmental Sensor Structure
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Solution Overview
Problem
Existing MEMS microphone and environmental sensor technologies require separate chips due to different detection principles, leading to increased chip and packaging costs, and occupy more space than modern electronic devices can accommodate.
Innovation Solution
An integrated structure where the MEMS microphone and environmental sensor share a base material, with a vibrating diaphragm and back electrode forming a capacitor structure for the microphone, and a sensitive electrode with a bending part extending into a groove forming a capacitor structure for the environmental sensor, allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate chips are used for MEMS microphone and environmental sensor, then each sensor can be optimized for its specific function, but the overall device size increases and packaging cost increases
Solution Approach 1:
The patent combines the MEMS microphone and environmental sensor into a single integrated chip structure. The vibrating diaphragm serves dual purposes: as the microphone's sound-sensitive element and as the environmental sensor's sensing component. This merging eliminates the need for separate chips and reduces overall device size while maintaining optimized performance for both functions.
Solution Approach 2:
The vibrating diaphragm structure is designed to perform multiple functions simultaneously. It acts as both the microphone's acoustic transducer and the environmental sensor's detection element. The capacitor structure formed by the diaphragm and back electrode enables both acoustic signal detection and environmental parameter measurement, achieving multi-functionality that reduces component count and device volume.
2Ease of manufacture
If separate chips are used for MEMS microphone and environmental sensor, then each sensor can be independently manufactured, but chip cost and packaging cost increase
Solution Approach 1:
The patent integrates both sensors into a single chip manufacturing process, eliminating the need for separate chip fabrication and packaging operations. This reduces packaging complexity and associated costs while maintaining manufacturing flexibility through standardized semiconductor processing techniques that can accommodate both sensor types on one substrate.
3Measurement precision
If parallel capacitor structure is used for environmental sensor, then the sensor can detect environmental changes, but the coverage area occupies larger space
Solution Approach 1:
The patent transitions from a planar parallel capacitor structure to a three-dimensional capacitor configuration. The vibrating diaphragm creates a capacitor structure that extends vertically, with the back electrode positioned beneath the diaphragm. This dimensional change allows the environmental sensor to achieve adequate sensing area while occupying less footprint on the chip, improving space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the overall package size, improves production efficiency, and decreases the coverage area of the environmental sensor to 1/5 to 1/10 of traditional sensors, aligning with the trend of lighter and thinner electronic devices.
Implementation Method 1
The base material is provided with a vibrating diaphragm and a back electrode which form a capacitor structure of the MEMS microphone
Implementation Method 2
the bending part and the side wall of the groove form a capacitor structure of the MEMS environment sensor
Implementation Method 3
a bending part extending into the groove
Data Source
AI summary
An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.