Integrated MEMS Sensor System for Accurate External Temperature Measurement
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Solution Overview
Problem
Existing MEMS microphones often suffer from thermal noise due to temperature sensors being influenced by the device's internal heat and user contact, which affects the accuracy of temperature readings, especially when trying to measure external environmental temperatures.
Innovation Solution
An integrated MEMS sensor system that combines an acoustic transducer, such as a microphone, with a temperature sensor on a single die, where the temperature sensor is directly coupled to the external environment through the sound port, minimizing contact with thermal noise sources like the device case or other electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is integrated with a MEMS microphone on a single die, then the functionality and measurement precision are improved, but the device complexity increases
Solution Approach 1:
The patent combines a temperature sensor and a MEMS microphone into a single integrated device structure on one die. The temperature sensor is positioned within the MEMS microphone assembly, allowing both functions to share the same housing and sensing environment. This merging approach enables simultaneous acoustic and temperature measurements without requiring separate devices, thereby improving measurement precision while managing device complexity through functional integration.
2Measurement precision
If the temperature sensor is placed close to the sound port to measure external environment temperature, then the measurement precision is improved, but the thermal noise from the device increases
Solution Approach 1:
The patent employs local quality by creating a dedicated thermal pathway from the sound port to the temperature sensor, isolating the sensor from general device heat sources. The temperature sensor is positioned to directly sense the external environment through the sound port while being thermally decoupled from the device's internal components. This localized sensing approach allows the sensor to measure external temperature accurately without being influenced by the device's internal thermal noise, as the sensor sits in a thermally isolated position that is acoustically coupled to the external environment.
3Object-affected harmful factors
If the temperature sensor is isolated from device heat sources, then the thermal noise is reduced, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the thermal environment into distinct zones: a thermal isolation zone containing the temperature sensor that is decoupled from device heat sources, and a thermal coupling zone that allows the sensor to sense external environmental temperature. The sensor is positioned within the MEMS microphone structure but thermally isolated from the device's internal components, creating a segmented thermal architecture that reduces thermal noise while managing complexity through structured thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for precise and accurate temperature measurement of the external environment with reduced thermal noise, enhancing the functionality of mobile electronics while maintaining a compact form factor.
Implementation Method 1
Many MEMS devices use capacitive sensing techniques for transducing the physical phenomenon into electrical signals. In such applications, the capacitance change in the sensor is converted to a voltage signal using interface circuits.
Implementation Method 2
In response to a sound pressure wave incident on the membrane, it deflects towards or away from the backplate, thereby changing the separation distance between the membrane and backplate.
Implementation Method 3
Various transducers exist that serve as thermometers by transducing temperature signals into electrical signals.
Data Source
AI summary
According to embodiment, a transducer includes a microfabricated element integrated on a single die and an interface IC coupled to the microfabricated element. The microfabricated element includes an acoustic transducer and a temperature sensor, and the interface IC is electrically coupled to the acoustic transducer and the temperature sensor.