Integrated Microchip Heat Sink with Embedded Cooling Channels
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Solution Overview
Problem
As microcircuit geometries shrink and operate at higher frequencies, heat density increases, making it difficult to effectively remove heat from complex microcircuit structures, especially when heat must flow through substrates and is generated deep within multi-layered or three-dimensional configurations.
Innovation Solution
An integrated heat sink is fabricated within the microchip, incorporating microchannels and valves to facilitate close proximity heat transfer and adaptive fluid flow, allowing for efficient heat removal from both interior and exterior surfaces, with materials like carbon nanotubes enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the microcircuit is attached to a heat sink on the back side of the substrate, then heat removal is possible, but the heat must flow through the substrate which limits the effectiveness of cooling
Solution Approach 1:
The patent transitions from conventional back-side heat sink attachment to integrating heat sink elements within the substrate layers and on the front surface. Heat sink structures are formed in vias, trenches, and embedded channels throughout the substrate thickness, creating three-dimensional heat dissipation pathways that eliminate the limitation of heat flowing only through the substrate back side.
Solution Approach 2:
The patent embeds heat sink structures within the substrate layers themselves. Heat generating devices are surrounded by heat sink material in vias and trenches, with cooling channels nested within the substrate. This nested configuration allows heat to be extracted directly at the source rather than requiring long heat flow paths through the substrate.
2Adaptability or versatility
If complex microcircuit structures such as chip stacking or multi-chip modules are used, then circuit functionality is enhanced, but heat generated deep within the structure becomes difficult to remove
Solution Approach 1:
The patent divides the heat removal function into multiple independent cooling channels distributed throughout the substrate. Each channel can be independently configured to serve specific heat generating regions. This segmentation allows heat from deep within multi-layer structures to be extracted through dedicated pathways without requiring heat to travel through entire substrate thicknesses.
Solution Approach 2:
The patent implements heat sink structures with locally optimized properties. Different regions of the substrate contain heat sink elements tailored to the specific heat generation characteristics of underlying devices. High heat flux regions receive enhanced cooling through densely packed heat sink material and dedicated cooling channels, while lower heat flux regions have correspondingly reduced cooling capacity.
3Temperature
If microchannels are incorporated into the heat sink to allow fluid flow, then heat transfer efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The patent combines the heat sink structure and cooling channels into a single integrated component fabricated within the substrate. The heat sink material forms both the thermal conduction pathways and the channel walls for coolant flow. This merging eliminates the need for separate heat sink and cooling system components, reducing overall device complexity while maintaining high heat transfer efficiency.
Solution Approach 2:
The heat sink structures serve multiple functions simultaneously: they provide thermal conduction pathways for heat extraction, form the walls and structure of cooling channels, and act as mechanical support within the substrate. This multi-functionality reduces the number of separate components needed and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat sink significantly improves heat removal by directing cooling fluid close to heat sources and varying fluid flow based on heat generation, effectively managing thermal challenges in complex microcircuit structures.
Implementation Method 1
a heat sink element thermally coupled with the plurality of interconnected electronic devices
Implementation Method 2
a means for flowing a heat transfer fluid through at least a portion of the means for conducting heat
Implementation Method 3
efficient heat removal by directing cooling fluid close to heat sources
Data Source
AI summary
In an embodiment, an integrated heat sink for a microchip includes a substrate having a plurality of interconnected electronic devices formed in a plurality of layers. At least one heat sink element is interposed within the layers and includes a microchannel to provide a fluid flow path for heat transfer. Other embodiments include a method of making an integrated heat sink for a microchip.