Integrated 45-Degree Mirror for Optical Signal Deflection
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Solution Overview
Problem
Existing solutions for integrating optical communication systems between IC chips face challenges such as positional inaccuracies, signal alignment issues, and high fabrication costs, leading to inefficient optical coupling and increased system complexity, which hinder the implementation of high-bandwidth optical interconnects.
Innovation Solution
The development of integrated optical communication systems using bulk silicon micromachining technology to fabricate 45-degree mirror structures in IC dies, allowing for precise and cost-effective optical signal deflection and routing between IC chips, enabling efficient optical coupling and reducing system complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If external mirrors or deflectors are used to transfer optical signals between IC chips, then optical coupling efficiency can be improved, but system complexity and fabrication costs increase significantly
Solution Approach 1:
The patent merges the optical deflection function into the IC chip itself by fabricating 45-degree mirror structures directly in the semiconductor substrate using bulk silicon micromachining. This eliminates the need for separate external mirrors or deflectors, thereby reducing system complexity while maintaining optical coupling efficiency. The mirror structure is integrated as part of the IC chip package, combining multiple functions into a single component.
Solution Approach 2:
The patent replaces mechanical alignment systems with precisely fabricated 45-degree angled mirror structures that provide inherent alignment guidance. The mirrored surfaces and angled geometries are fabricated with high precision using semiconductor manufacturing techniques, eliminating the need for complex mechanical adjustment mechanisms while achieving accurate optical coupling between chips.
2Reliability
If fiber optic waveguides are used for optical interconnects, then signal transmission can be achieved, but bandwidth limitations and additional costs are imposed
Solution Approach 1:
The patent extracts the optical signal path from confined waveguide structures and allows free-space optical propagation between IC chips. By removing the signal from enclosed waveguides and using direct optical paths with integrated mirrors for deflection, the system achieves higher bandwidth capability while eliminating the bandwidth limitations inherent in fiber optic waveguide structures.
3Measurement precision
If precise alignment structures are implemented to account for perpendicular alignment between IC chip and backplane, then optical coupling accuracy improves, but fabrication costs and complexities increase
Solution Approach 1:
The patent implements self-aligning features where the 45-degree mirror structures and optical paths are fabricated as integral parts of the IC chip and backplane assemblies. The geometry of the mirrored surfaces and optical channels provides inherent alignment guidance, allowing the components to self-align during assembly without requiring complex external alignment mechanisms or expensive precision adjustment facilities.
Solution Approach 2:
The patent changes the fabrication approach from mechanical alignment to precision semiconductor fabrication. By using bulk silicon micromachining to create 45-degree angled surfaces with precise geometries, the alignment parameters are defined during fabrication rather than during assembly, achieving high precision at volumes compatible with semiconductor manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density, low-power, high-performance optical communication systems with improved alignment and reduced costs, facilitating efficient optical signal transmission between IC chips and overcoming previous limitations in optical interconnects.
Implementation Method 1
a mirror structure (22) formed with a 45-degree mirror surface (23) to deflect perpendicularly received optical signals into the lateral plane
Data Source
AI summary
An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.