Integrated MMC Package With Molded Inductor for EMI and Space Reduction
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Solution Overview
Problem
Conventional power converters occupy valuable space on circuit boards and affect noise performance due to separate transistor and magnetic components, which are soldered separately and can cause electromagnetic interference.
Innovation Solution
An integrated electronic device with first and second metal structures, a semiconductor die, and a molded magnetic package structure, where coils and die terminals are enclosed within a single package, allowing for modular integration and reduced electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate transistor and magnetic components are used, then ease of manufacture is improved, but device area increases and electromagnetic interference worsens
Solution Approach 1:
The patent combines the transistor (semiconductor die) and magnetic component (inductor with coils) into a single integrated package. The semiconductor die is mounted on a substrate with coils formed thereon, and the entire assembly is encapsulated in a molded package, creating one unified device that replaces multiple discrete components.
Solution Approach 2:
The patent employs a nested structure where the semiconductor die is mounted on the substrate, the coils are formed on the substrate surrounding the die, and the entire assembly is encapsulated within the molded package structure. This nesting allows multiple functional elements to occupy overlapping spatial volumes, reducing the overall device footprint.
2Ease of manufacture
If separate transistor and magnetic components are used, then ease of manufacture is improved, but electromagnetic interference worsens
Solution Approach 1:
The patent combines the transistor (semiconductor die) and magnetic component (inductor with coils) into a single integrated package. The semiconductor die is mounted on a substrate with coils formed thereon, and the entire assembly is encapsulated in a molded package, creating one unified device that replaces multiple discrete components.
Solution Approach 2:
The substrate acts as an intermediary structure that provides both mechanical support and electrical interconnection. It includes coil structures formed on its surfaces and provides shielding between the semiconductor die and external environment, reducing electromagnetic interference while maintaining manufacturability.
3Area of stationary object
If integrated package is used, then device area decreases, but manufacturing complexity increases
Solution Approach 1:
The integrated device is segmented into distinct functional layers: the semiconductor die mounted on the substrate, the coil structures formed on the substrate surfaces, and the molded package encapsulation. This segmentation allows each component to be manufactured and positioned independently before final assembly, managing complexity through modular construction.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for the semiconductor die, forms the coil structures for magnetic functionality, provides electrical interconnection between components, and offers electromagnetic shielding. This multi-functionality reduces the need for separate structural elements, managing complexity while achieving integration.
4Power
If integrated package is used, then power density increases, but manufacturing precision requirements increase
Solution Approach 1:
The coil structures are formed on the substrate before the semiconductor die is mounted. This preliminary formation of magnetic components allows for precise positioning and integration, as the coil patterns can be defined during substrate fabrication using standard photolithography and metallization processes, reducing precision requirements during later assembly steps.
Solution Approach 2:
Traditional mechanical assembly methods are replaced with direct bonding and reflow soldering processes. The semiconductor die is attached to the substrate using die attach materials and bonded through reflow soldering, eliminating the need for separate mechanical mounting operations and reducing precision requirements associated with mechanical alignment and fastening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces system size, increases power density, and improves inductance performance while minimizing electromagnetic interference and cost.
Implementation Method 1
The molded magnetic package structure encloses portions of the first and second coils and a portion of the semiconductor die
Implementation Method 2
The first metal structure has a first coil extending in a first plane and the second metal structure has a second coil extending in a parallel second plane
Data Source
AI summary
An electronic device includes a first metal structure with a first coil extending in a first plane and a first coil terminal, a second metal structure with a second coil extending in a second plane and a second coil terminal, the second plane approximately parallel to the first plane, a semiconductor die with die terminals and opposite first and second sides, the first side attached to the first metal structure and the die terminals extending outward from the second side to a parallel third plane, and a molded magnetic package structure enclosing portions of the first and second coils and a portion of the semiconductor die, wherein the die terminals and the first and second coil terminals are exposed outside the molded magnetic package structure along the third plane.