Integrated Millimeter Wave Antenna and Transceiver on Substrate
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Solution Overview
Problem
Existing semiconductor structures face challenges in efficiently capturing millimeter wave signals due to signal attenuation and impedance mismatch between antennas and semiconductor chips, as well as the difficulty in aligning reflector plates for improved signal capture and routing.
Innovation Solution
A semiconductor structure integrating a millimeter wave antenna, a reflector plate, and a transceiver on a substrate, where the antenna is located in a dielectric layer on the front side and the reflector plate is on the backside, connected via through-substrate vias to maintain a quarter wavelength separation, enhancing radiation efficiency and minimizing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a millimeter wave antenna is attached to a semiconductor chip through a C4 pad or wirebond pad, then the antenna can be connected to the chip, but impedance mismatch occurs at the interface resulting in signal loss
Solution Approach 1:
The patent merges the antenna structure directly with the semiconductor chip by fabricating the antenna in the same planar structure as the chip, eliminating the need for separate attachment components (C4 pads or wirebond pads). This integration ensures continuous impedance matching across the entire structure, preventing signal loss at interfaces while maintaining reliable signal capture.
2Reliability
If a reflector plate is added to increase antenna efficiency, then signal capture improves, but aligning the reflector plate with the semiconductor chip and antenna becomes challenging
Solution Approach 1:
The reflector plate is merged with the semiconductor chip structure by fabricating it as an integrated component on the same substrate. This integration eliminates the need for separate alignment operations between the reflector plate, antenna, and chip, as all components are co-fabricated in their precise relative positions, thereby maintaining high signal capture efficiency while reducing alignment complexity.
Solution Approach 2:
The reflector plate's position and orientation are predetermined during the chip fabrication process itself, rather than requiring post-fabrication alignment. By pre-establishing the correct geometric relationships between the reflector plate, antenna, and chip during manufacturing, the system achieves optimal signal capture without complex alignment procedures.
3Device complexity
If the antenna is incorporated into a wiring level dielectric material layer on a semiconductor chip, then integration is achieved, but the distance between the antenna and reflector plate is insufficient resulting in poor signal capture efficiency
Solution Approach 1:
The patent transitions from a two-dimensional planar integration approach to a three-dimensional vertical stacking architecture. The antenna is positioned in a first dielectric layer while the reflector plate is placed in a second dielectric layer at a different vertical level, enabling sufficient separation distance (approximately quarter-wavelength) between components while maintaining compact integration within the chip structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the capture and routing of millimeter wave signals with reduced signal loss and increased radiation efficiency, addressing the limitations of prior art by optimizing the placement and connection of antenna and reflector plate components.
Implementation Method 1
Millimeter waves refer to electromagnetic radiation having a wavelength range from about 1 mm to about 10 mm
Implementation Method 2
The reflector plate is located on the backside of the semiconductor substrate, and is connected to the through substrate via. The separation between the reflector plate and the antenna is about a quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna
Implementation Method 3
A through substrate via provides electrical connection between the transceiver and the backside of the semiconductor substrate
Data Source
AI summary
A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.