Integrated Electronic Module Assembly via Through Connection Element
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Solution Overview
Problem
The assembly of notebook computers is labor-intensive and prone to errors due to the need for connecting multiple electronic units to a main board through lead wires, which is time-consuming and hindered by visual obstructions from the casing, potentially causing component damage.
Innovation Solution
An electronic device comprising a first electronic module with integrated electronic units and lead wires connected to a daughterboard, and a through connection element that connects this module to a second electronic module via flexible connectors, allowing for easier assembly and reducing the need for direct wire connections to the main board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If workers connect electronic units to main board through lead wires one by one, then assembly is completed, but assembly time and labor cost increase significantly
Solution Approach 1:
The patent merges multiple electronic units and their connecting lead wires into a single integrated module. This consolidation allows the entire module to be connected to the main board through a single interface, eliminating the need for workers to connect each electronic unit individually with separate lead wires, thereby dramatically reducing assembly time and labor requirements
Solution Approach 2:
The patent segments the assembly system into two main parts: an integrated module containing multiple electronic units and lead wires, and the main board. This segmentation allows the complex internal wiring to be pre-assembled and tested as a unit, simplifying the final assembly process where only the module connection is required
2Reliability
If casing shields components during assembly, then device structure is complete, but worker cannot observe component positions leading to assembly errors
Solution Approach 1:
The patent applies preliminary action by pre-assembling and pre-positioning all electronic units and lead wires within the integrated module before the final assembly stage. This ensures that component positions are predetermined and fixed, eliminating the need for workers to visually locate and position components during assembly, thus preventing assembly errors while maintaining ease of operation
3Reliability
If multiple lead wires are used to connect electronic units, then electrical connections are established, but complexity of assembly process increases
Solution Approach 1:
The patent merges multiple lead wires and electronic units into a single integrated module with a unified connection interface. This consolidation maintains all necessary electrical connections within the module while presenting only one connection point to the main board, thereby ensuring electrical reliability without increasing assembly process complexity
Data Source
AI summary
An electronic device and an assembling method thereof are provided. The electronic device includes a first electronic module, a second electronic module, and a through connection element. The first electronic module includes a plurality of electronic units, a plurality of lead wires, a daughterboard, and a first connector. The first connector is disposed on the daughterboard. The lead wires are separately connected between the electronic units and the daughterboard. The daughterboard is electrically connected between the lead wires and the first connector. The second electronic module includes a motherboard and a second connector, wherein the second connector disposed on the motherboard is electrically connected with the motherboard. The through connection element being assembled between the first and the second connectors is electrically connected to the first and the second connectors to connect the first electronic module with the second electronic module.